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8 条记录 (耗时 0.018 秒)

    Process for preparing an acrylic or methacrylic acid ester
    1.
    发明授权
    Process for preparing an acrylic or methacrylic acid ester 失效
    制备丙烯酸或甲基丙烯酸酯的方法

    公开(公告)号：US4474981A

    公开(公告)日：1984-10-02

    申请号：US405368

    申请日：1982-08-05

    申请人： Michio Katoh ,  Tadashi Abe ,  Masanori Moriwaki

    发明人： Michio Katoh ,  Tadashi Abe ,  Masanori Moriwaki

    IPC分类号： C07C67/08 ,  C07C69/54

    CPC分类号： C07C69/54 ,  C07C67/08

    摘要： A process for preparing an acrylic or methacrylic acid ester comprising esterifying the acrylic or methacrylic acid with an alcohol in a water-insoluble and non-reactive organic solvent in the presence of an acid catalyst, the volume ratio of the organic solvent phase to an aqueous solution phase of the acid catalyst being as small as 0.1 to 1.0, whereby a reactor is allowed to be small-sized and a conversion of the esterification is kept high. The acrylic or methacrylic acid ester is useful as a starting material of an acrylic resin or acrylic resin coating, an adhesive or the like.

    摘要翻译： 一种制备丙烯酸或甲基丙烯酸酯的方法，包括在酸性催化剂存在下，在水不溶性和非反应性有机溶剂中，用醇将丙烯酸或甲基丙烯酸酯化，有机溶剂相与水相的体积比 酸催化剂的溶液相小至0.1至1.0，由此允许反应器小型化，酯化转化率保持较高。 丙烯酸或甲基丙烯酸酯可用作丙烯酸树脂或丙烯酸树脂涂料，粘合剂等的原料。

    Metal gasket with coolant contact areas
    6.
    发明授权
    Metal gasket with coolant contact areas 失效
    带冷却液接触区域的金属垫片

    公开(公告)号：US5584490A

    公开(公告)日：1996-12-17

    申请号：US466423

    申请日：1995-06-06

    申请人： Kunitoshi Inoue ,  Masahiko Miura ,  Kazukuni Takada ,  Hideo Yamamoto ,  Michio Katoh ,  Tetsuhiro Hosokawa ,  Hitoshi Shimamura

    发明人： Kunitoshi Inoue ,  Masahiko Miura ,  Kazukuni Takada ,  Hideo Yamamoto ,  Michio Katoh ,  Tetsuhiro Hosokawa ,  Hitoshi Shimamura

    IPC分类号： F02F11/00 ,  F16J15/08

    CPC分类号： F16J15/0825 ,  F16J2015/0843 ,  F16J2015/085 ,  F16J2015/0856

    摘要： This metal gasket is formed by laminating a pair of bead plates and a pair of intermediate plates, and capable of setting the temperature distribution thereof uniform by efficiently cooling high-temperature regions which are in the vicinity of swirl chambers without causing a decrease in the rigidity and strength thereof. The portions of the bead plates which are in the vicinity of the parts thereof in which the swirl chambers are positioned are provided with coolant-contact areas surrounded by half beads formed on the bead plates, these coolant-contact areas being provided with holes. The wall surfaces of these holes directly contact the cooling water flowing in a water jacket in a cylinder head, and fulfil the function of radiating the heat transmitted from a high-temperature combustion gas thereto.

    摘要翻译： 该金属垫圈是通过层叠一对胎圈板和一对中间板而形成的，能够通过有效地冷却在涡流室附近的高温区域而使其温度分布均匀，而不会降低刚性 及其强度。 在其中设置有涡流室的部分附近的胎圈板的部分设置有由形成在胎圈板上的半个小球包围的冷却剂接触区域，这些冷却剂接触区域设置有孔。 这些孔的壁面直接接触在气缸盖中的水套中流动的冷却水，并且具有将从高温燃烧气体传递的热量散发到其中的功能。

    Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
    7.
    发明授权
    Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor 失效
    塑料封装半导体器件及其引线框架的制造方法

    公开(公告)号：US4451973A

    公开(公告)日：1984-06-05

    申请号：US367809

    申请日：1982-04-13

    申请人： Kenichi Tateno ,  Masami Yokozawa ,  Hiroyuki Fujii ,  Mikio Nishikawa ,  Michio Katoh ,  Fujio Wada

    发明人： Kenichi Tateno ,  Masami Yokozawa ,  Hiroyuki Fujii ,  Mikio Nishikawa ,  Michio Katoh ,  Fujio Wada

    IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L21/58

    CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T428/12194

    摘要： A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips which extend outside a plastic encapsulating housing along the end face of the plastic encapsulating housing and cutting a connecting portion between the external leads and the first connecting band.Also provided is a lead frame having the strips as described above.A plastic layer of desired thickness can be formed on the rear surface of the substrate support. Cutting of the strips from the plastic encapsulating housing is easy and reliable.

    摘要翻译： 提供了一种用于制造塑料封装的半导体器件的方法，其包括以下步骤：通过上模和下模至少夹紧外部引线和半导体器件组合带，所述半导体器件组件使用引线框形成，所述引线框具有连接到外部引线的第一连接带 从进一步用作散热器的基板支撑件的一侧延伸，以及连接到具有小横截面积和预定长度并且从基板支撑件的另一侧延伸的部分的条的第二连接带， 部分垂直于条的延伸方向，使得基板支撑件可以浮动在由上模具和下模具形成的空腔中，并且小横截面区域的部分的部分可以设置在空腔中，其余部分 可以设置在上模和下模之间; 将塑料注入腔内; 以及沿着所述塑料封装壳体的端面切割延伸到塑料封装壳体外侧的条的小横截面区域的部分，并切割外部引线与第一连接带之间的连接部分。 还提供了具有如上所述的条带的引线框架。 可以在基板支撑件的后表面上形成所需厚度的塑料层。 从塑料封装壳体切割条是容易和可靠的。