公开(公告)号：US20170247807A1

公开(公告)日：2017-08-31

申请号：US15358027

申请日：2016-11-21

申请人： Microfabrica Inc.

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： C25D5/02 ,  C23C18/16 ,  B81C1/00 ,  C25D1/00

CPC分类号： C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

摘要： Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US10676836B2

公开(公告)日：2020-06-09

申请号：US16118267

申请日：2018-08-30

申请人： Microfabrica Inc.

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： C25D5/02 ,  B81C1/00 ,  C25D1/00 ,  C23C18/16

摘要： Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US20190017189A1

公开(公告)日：2019-01-17

申请号：US16118267

申请日：2018-08-30

申请人： Microfabrica Inc.

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： C25D5/02 ,  C23C18/16 ,  C25D1/00 ,  B81C1/00

CPC分类号： C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

摘要： Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US09546431B2

公开(公告)日：2017-01-17

申请号：US14185613

申请日：2014-02-20

申请人： Microfabrica Inc.

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： C25D5/02 ,  C25D1/00 ,  C23C18/16 ,  B81C1/00

CPC分类号： C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

摘要翻译： 本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。 某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。 一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。 一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。 一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。 其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。

公开(公告)号：US20140209473A1

公开(公告)日：2014-07-31

申请号：US14185613

申请日：2014-02-20

申请人： Microfabrica Inc.

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： C25D5/02

CPC分类号： C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

摘要翻译： 本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。 某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。 一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。 一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。 一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。 其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。