公开(公告)号：US20240117855A1

公开(公告)日：2024-04-11

申请号：US17962927

申请日：2022-10-10

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Bradley R. Bitz ,  Mark A. Tverdy ,  Quang Nguyen ,  Christopher Glancey ,  Jagadeesh B. Ginjupalli ,  Pridhvi Dandu

IPC: F16F15/04 ,  H05K5/02

CPC classification number: F16F15/04 ,  H05K5/0217 ,  F16F2226/04 ,  F16F2226/042

Abstract: Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.