公开(公告)号：US20230216225A1

公开(公告)日：2023-07-06

申请号：US17677011

申请日：2022-02-22

Applicant: Micron Technology, Inc.

Inventor： Bradley R. Bitz ,  Joao E. Chaves ,  Kaleb A. Wilson ,  Mark Tverdy

IPC: H01R12/70 ,  H01R12/52 ,  H01R12/72 ,  H01R12/53 ,  H01G9/26

CPC classification number: H01R12/7076 ,  H01G9/26 ,  H01R12/52 ,  H01R12/53 ,  H01R12/721

Abstract: Apparatuses, systems, and methods for coupling a capacitor to a printed circuit board assembly. One example apparatus can include a number of capacitors and a connector coupled to the number of capacitors, the connector configured to removably couple the number of capacitors to a printed circuit board assembly of a solid state drive.

公开(公告)号：US20240305026A1

公开(公告)日：2024-09-12

申请号：US18596264

申请日：2024-03-05

Applicant: Micron Technology, Inc.

Inventor： Mark A. Tverdy ,  Kaleb A. Wilson

IPC: H01R12/73 ,  H01R12/70 ,  H01R25/00 ,  H05K7/02 ,  H05K7/10

CPC classification number: H01R12/73 ,  H01R12/7088 ,  H01R25/006 ,  H05K7/023 ,  H05K7/1076

Abstract: Various embodiments described herein provide a connector assembly with integrated data and backup energy connections, which can be used to electrically couple together two or more printed circuit boards and electrically couple at least one of those printed circuit boards to a backup energy source. For example, a connector assembly of an embodiment can be used to implement a memory sub-system by coupling together two or more printed circuit boards of the memory sub-system and coupling the memory sub-system to a backup energy source, such as a set of capacitors or a set of batteries, which can be used to power the memory sub-system in the event of a main power loss.

公开(公告)号：US20240071863A1

公开(公告)日：2024-02-29

申请号：US17821871

申请日：2022-08-24

Applicant: Micron Technology, Inc.

Inventor： Charles E. Siko ,  Kaleb A. Wilson ,  Bradley R. Bitz

IPC: H01L23/40 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/40 ,  H01L23/4006 ,  H01L23/49811 ,  H01L25/0655 ,  H01L24/16

Abstract: A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.

公开(公告)号：US11997782B2

公开(公告)日：2024-05-28

申请号：US17459102

申请日：2021-08-27

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Shams U Arifeen ,  Bradley Russell Bitz ,  João Elmiro Da Rocha Chaves ,  Mark A. Tverdy

IPC: H05K1/02

CPC classification number: H05K1/0207 ,  H05K2201/10159 ,  H05K2201/10545

Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).

公开(公告)号：US20240117855A1

公开(公告)日：2024-04-11

申请号：US17962927

申请日：2022-10-10

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Bradley R. Bitz ,  Mark A. Tverdy ,  Quang Nguyen ,  Christopher Glancey ,  Jagadeesh B. Ginjupalli ,  Pridhvi Dandu

IPC: F16F15/04 ,  H05K5/02

CPC classification number: F16F15/04 ,  H05K5/0217 ,  F16F2226/04 ,  F16F2226/042

Abstract: Apparatuses, systems, and methods for a damper for a printed circuit board assembly (PCBA). One example apparatus can include a PCBA of a solid state drive (SSD) and a damper configured to contact the PCBA, contact an enclosure of the SSD, and damp shock impulses applied to the SSD.

公开(公告)号：US20230065633A1

公开(公告)日：2023-03-02

申请号：US17459102

申请日：2021-08-27

Applicant: Micron Technology, Inc.

Inventor： Kaleb A. Wilson ,  Shams U. Arifeen ,  Bradley Russell Bitz ,  João Elmiro da Rocha Chaves ,  Mark A. Tverdy

IPC: H05K1/02

Abstract: Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).