公开(公告)号：US20230058288A1

公开(公告)日：2023-02-23

申请号：US17979750

申请日：2022-11-02

Applicant: Micron Technology, Inc.

Inventor： Raju Ahmed ,  Frank Speetjens ,  Darin S. Miller ,  Siva Naga Sandeep Chalamalasetty ,  Dave Pratt ,  Yi Hu ,  Yung-Ta Sung ,  Aaron K. Belsher ,  Allen R. Gibson

IPC: H01L21/768 ,  H01L23/522

Abstract: Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.

公开(公告)号：US20220199123A1

公开(公告)日：2022-06-23

申请号：US17693119

申请日：2022-03-11

Applicant: Micron Technology, Inc.

Inventor： Raju Ahmed ,  David A. Kewley ,  Dave Pratt ,  Yung-Ta Sung ,  Frank Speetjens ,  Gurpreet Lugani

IPC: G11C5/06 ,  H01L23/532

Abstract: Some embodiments include an integrated assembly having an interconnect over a first conductive structure and coupled with the first conductive structure. The interconnect includes a conductive core. The conductive core has a slender upper region and a wide lower region. The upper region joins to the lower region at a step. A liner laterally surrounds the lower region of the conductive core. The liner has an upper surface which is substantially coplanar with the step. An insulative collar is over and directly against both an upper surface of the step and the upper surface of the liner. The insulative collar laterally surrounds and directly contacts the slender upper region. A second conductive structure is over and directly against a region of the insulative collar, and is over and directly against an upper surface of the slender upper region. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US20210249304A1

公开(公告)日：2021-08-12

申请号：US16787321

申请日：2020-02-11

Applicant: Micron Technology, Inc.

Inventor： Raju Ahmed ,  Frank Speetjens ,  Darin S. Miller ,  Siva Naga Sandeep Chalamalasetty ,  Dave Pratt ,  Yi Hu ,  Yung-Ta Sung ,  Aaron K. Belsher ,  Allen R. Gibson

IPC: H01L21/768 ,  H01L23/522

Abstract: Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.

公开(公告)号：US20210193189A1

公开(公告)日：2021-06-24

申请号：US16718454

申请日：2019-12-18

Applicant: Micron Technology, Inc.

Inventor： Raju Ahmed ,  David A. Kewley ,  Dave Pratt ,  Yung-Ta Sung ,  Frank Speetjens ,  Gurpreet Lugani

IPC: G11C5/06 ,  H01L23/532

Abstract: Some embodiments include an integrated assembly having an interconnect over a first conductive structure and coupled with the first conductive structure. The interconnect includes a conductive core. The conductive core has a slender upper region and a wide lower region. The upper region joins to the lower region at a step. A liner laterally surrounds the lower region of the conductive core. The liner has an upper surface which is substantially coplanar with the step. An insulative collar is over and directly against both an upper surface of the step and the upper surface of the liner. The insulative collar laterally surrounds and directly contacts the slender upper region. A second conductive structure is over and directly against a region of the insulative collar, and is over and directly against an upper surface of the slender upper region. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US11978527B2

公开(公告)日：2024-05-07

申请号：US17693119

申请日：2022-03-11

Applicant: Micron Technology, Inc.

Inventor： Raju Ahmed ,  David A. Kewley ,  Dave Pratt ,  Yung-Ta Sung ,  Frank Speetjens ,  Gurpreet Lugani

IPC: H01L23/532 ,  G11C5/06

CPC classification number: G11C5/06 ,  H01L23/53257 ,  H01L23/5329

Abstract: Some embodiments include an integrated assembly having an interconnect over a first conductive structure and coupled with the first conductive structure. The interconnect includes a conductive core. The conductive core has a slender upper region and a wide lower region. The upper region joins to the lower region at a step. A liner laterally surrounds the lower region of the conductive core. The liner has an upper surface which is substantially coplanar with the step. An insulative collar is over and directly against both an upper surface of the step and the upper surface of the liner. The insulative collar laterally surrounds and directly contacts the slender upper region. A second conductive structure is over and directly against a region of the insulative collar, and is over and directly against an upper surface of the slender upper region. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US11545391B2

公开(公告)日：2023-01-03

申请号：US16787321

申请日：2020-02-11

Applicant: Micron Technology, Inc.

Inventor： Raju Ahmed ,  Frank Speetjens ,  Darin S. Miller ,  Siva Naga Sandeep Chalamalasetty ,  Dave Pratt ,  Yi Hu ,  Yung-Ta Sung ,  Aaron K. Belsher ,  Allen R. Gibson

IPC: H01L21/768 ,  H01L23/522

Abstract: Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.

公开(公告)号：US11328749B2

公开(公告)日：2022-05-10

申请号：US16718454

申请日：2019-12-18

Applicant: Micron Technology, inc.

Inventor： Raju Ahmed ,  David A. Kewley ,  Dave Pratt ,  Yung-Ta Sung ,  Frank Speetjens ,  Gurpreet Lugani

IPC: H01L23/532 ,  G11C5/06

Abstract: Some embodiments include an integrated assembly having an interconnect over a first conductive structure and coupled with the first conductive structure. The interconnect includes a conductive core. The conductive core has a slender upper region and a wide lower region. The upper region joins to the lower region at a step. A liner laterally surrounds the lower region of the conductive core. The liner has an upper surface which is substantially coplanar with the step. An insulative collar is over and directly against both an upper surface of the step and the upper surface of the liner. The insulative collar laterally surrounds and directly contacts the slender upper region. A second conductive structure is over and directly against a region of the insulative collar, and is over and directly against an upper surface of the slender upper region. Some embodiments include methods of forming integrated assemblies.