公开(公告)号：US10062727B2

公开(公告)日：2018-08-28

申请号：US15393187

申请日：2016-12-28

Applicant: Microsoft Technology Licensing, LLC

Inventor： Geoffrey P. McKnight ,  Brian K. Guenter ,  Andrew Keefe ,  Neel S. Joshi

IPC: H04N5/372 ,  H01L27/146 ,  H01L21/304 ,  H04N5/378 ,  G06T3/40 ,  H04N5/376

CPC classification number: H01L27/14683 ,  G06T3/4007 ,  H01L21/302 ,  H01L21/304 ,  H01L21/67092 ,  H01L27/14601 ,  H01L27/14618 ,  H04N5/372 ,  H04N5/376 ,  H04N5/378

Abstract: Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.

公开(公告)号：US20180076257A1

公开(公告)日：2018-03-15

申请号：US15393187

申请日：2016-12-28

Applicant: Microsoft Technology Licensing, LLC

Inventor： Geoffrey P. McKnight ,  Brian K. Guenter ,  Andrew Keefe ,  Neel S. Joshi

IPC: H01L27/146 ,  H01L21/304 ,  H04N5/372 ,  H04N5/378 ,  G06T3/40 ,  H04N5/376

CPC classification number: H01L27/14683 ,  G06T3/4007 ,  H01L21/304 ,  H01L21/67092 ,  H01L27/14601 ,  H01L27/14618 ,  H04N5/372 ,  H04N5/376 ,  H04N5/378

Abstract: Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.

公开(公告)号：US20160293429A1

公开(公告)日：2016-10-06

申请号：US14677697

申请日：2015-04-02

Applicant: Microsoft Technology Licensing, LLC

Inventor： Andrew Keefe ,  Geoffrey P. McKnight ,  Guillermo Herrera

IPC: H01L21/304 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L21/304 ,  H01L23/13 ,  H01L24/83 ,  H01L27/14601 ,  H01L27/14607 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14698 ,  H01L2224/83385

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

Abstract translation: 用于制造具有弯曲表面的半导体芯片的技术可以包括将基本上平坦的半导体芯片放置在凹模的凹陷表面中，使得半导体芯片的拐角或边缘不受限制，或者半导体芯片的仅部分物理接触 凹模; 并且通过在半导体芯片上向凹入表面的底部施加力而弯曲基本平坦的半导体芯片以形成凹形半导体芯片。 半导体芯片的拐角或边缘在弯曲期间相对于凹部表面移动或滑动。

公开(公告)号：US10304900B2

公开(公告)日：2019-05-28

申请号：US14677622

申请日：2015-04-02

Applicant: Microsoft Technology Licensing, LLC

Inventor： Andrew Keefe ,  Geoffrey P. McKnight ,  Guillermo Herrera

IPC: H01L21/00 ,  H01L27/148 ,  H01L27/146

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

公开(公告)号：US10068944B2

公开(公告)日：2018-09-04

申请号：US14677622

申请日：2015-04-02

Applicant: Microsoft Technology Licensing, LLC

Inventor： Andrew Keefe ,  Geoffrey P. McKnight ,  Guillermo Herrera

IPC: H01L21/00 ,  H01L27/148 ,  H01L27/146

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

公开(公告)号：US09870927B2

公开(公告)日：2018-01-16

申请号：US14677697

申请日：2015-04-02

Applicant: Microsoft Technology Licensing, LLC

Inventor： Andrew Keefe ,  Geoffrey P. McKnight ,  Guillermo Herrera

IPC: H01L31/0203 ,  H01L31/00 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/304 ,  H01L23/13 ,  H01L23/00 ,  H01L27/146

CPC classification number: H01L21/304 ,  H01L23/13 ,  H01L24/83 ,  H01L27/14601 ,  H01L27/14607 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14698 ,  H01L2224/83385

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

公开(公告)号：US20160293661A1

公开(公告)日：2016-10-06

申请号：US14677622

申请日：2015-04-02

Applicant: Microsoft Technology Licensing, LLC

Inventor： Andrew Keefe ,  Geoffrey P. McKnight ,  Guillermo Herrera

IPC: H01L27/148 ,  H01L27/146

CPC classification number: H01L27/14806 ,  H01L27/14601 ,  H01L27/14607 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14698

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

Abstract translation: 用于制造具有弯曲表面的半导体芯片的技术包括将基本上平坦的光子传感器芯片放置在模具的凹陷表面上，使得光子传感器芯片的有源区域至少部分地覆盖模具的凹入中心区域和非活动区域 所述光子传感器芯片至少部分地覆盖所述模具的凸出的周边区域。 模具具有径向变化的曲率，并且凹入表面包括凹形中心区域和同心地围绕凹入中心区域的凸出周边区域。 可以对光子传感器芯片施加压力以将光子传感器芯片压入并弯曲到模具中。