公开(公告)号：US10690829B2

公开(公告)日：2020-06-23

申请号：US15618079

申请日：2017-06-08

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Kelly Marie Bogan ,  Benjamin Sullivan

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  F21V8/00 ,  F21V9/08 ,  F21V23/06 ,  F21V33/00 ,  A41D27/08 ,  F21Y115/10

Abstract: Examples disclosed herein relate to using optical fibers in a textile to channel light from a light source to various exit locations within the textile. One example provides an optical device, comprising a light source, an optical fiber extending from the light source, the optical fiber configured to conduct light received from the light source via internal reflection, and a plurality of individually controllable light-emitting locations disposed along the optical fiber.

公开(公告)号：US10312415B2

公开(公告)日：2019-06-04

申请号：US15627215

申请日：2017-06-19

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Benjamin Sullivan

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/00 ,  H01L25/075 ,  H05K3/28 ,  H01L33/20 ,  H05K1/03

Abstract: An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.

公开(公告)号：US10935436B2

公开(公告)日：2021-03-02

申请号：US15647080

申请日：2017-07-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Benjamin Sullivan ,  Siyuan Ma ,  James David Holbery ,  Collin Alexander Ladd ,  Kelly Marie Bogan

IPC: G01K3/00 ,  G01K7/04 ,  G01K3/14 ,  A41D1/00 ,  A61B5/01 ,  A61B5/00 ,  A63B71/00 ,  G01K1/14

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

公开(公告)号：US10772197B2

公开(公告)日：2020-09-08

申请号：US15961355

申请日：2018-04-24

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Don Pasindu Vijai Lugoda ,  Kelly Marie Bogan ,  Siyuan Ma ,  Benjamin Sullivan

IPC: H05K1/03 ,  D02G3/36 ,  H05K1/18 ,  H01B7/29 ,  H05K9/00 ,  H05K3/32 ,  H05K3/00 ,  H01B13/22 ,  H05K3/40 ,  H05K3/28 ,  H01B13/00 ,  D02G3/44 ,  D02G3/38 ,  H01B7/18 ,  G06F3/01 ,  A41B1/08

Abstract: Examples are disclosed that relate to electronically functional yarns. One example provides an electronically functional yarn comprising a core, a sheath at least partially surrounding the core, and an electronic circuit formed on the core. The circuit includes three or more control lines and more than three diode-containing circuit elements controllable by the three or more control lines, each circuit element being controllable via a corresponding set of two of the three or more control lines.

公开(公告)号：US11841280B2

公开(公告)日：2023-12-12

申请号：US17249170

申请日：2021-02-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Benjamin Sullivan ,  Siyuan Ma ,  James David Holbery ,  Collin Alexander Ladd ,  Kelly Marie Bogan

IPC: G01K7/04 ,  A41D1/00 ,  A61B5/01 ,  G01K3/14 ,  A61B5/00 ,  A63B71/00 ,  G01K1/14

CPC classification number: G01K7/04 ,  A41D1/002 ,  A61B5/015 ,  A61B5/6804 ,  A63B71/00 ,  G01K1/14 ,  G01K3/14 ,  A41D2500/30 ,  A63B2230/50 ,  G01K2213/00

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.