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    Curved circuit board
    4.
    发明授权
    Curved circuit board 有权

    公开(公告)号：US10180708B2

    公开(公告)日：2019-01-15

    申请号：US15163386

    申请日：2016-05-24

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Kenneth Charles Boman ,  Kanth Kurumaddali

    IPC: G06F1/20 ,  H05K1/02

    Abstract: A curved printed circuit board (PCB) of a computing device is described herein. The computing device includes a housing and a PCB positioned in or on the housing. The computing device also includes a plurality of connectors physically connecting the PCB to a surface of the housing or another surface, such that at least a portion of the PCB is bent.

    BLACK BODY RADIATION IN A COMPUTING DEVICE
    5.
    发明申请
    BLACK BODY RADIATION IN A COMPUTING DEVICE 审中-公开

    公开(公告)号：US20170277235A1

    公开(公告)日：2017-09-28

    申请号：US15083285

    申请日：2016-03-28

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Andrew Douglas Delano ,  Aaron Albert Oro ,  Kanth Kurumaddali

    IPC: G06F1/20 ,  G06F1/18 ,  G06F1/16 ,  H05K7/20

    CPC classification number: G06F1/206 ,  G06F1/1601 ,  G06F1/203 ,  H01L23/427 ,  H01L23/467 ,  H05K7/20336 ,  H05K7/20427 ,  H05K7/20436 ,  H05K7/20709

    Abstract: Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

    Electronic device with a magnetically attached electronic component
    6.
    发明授权
    Electronic device with a magnetically attached electronic component 有权

    公开(公告)号：US10555427B2

    公开(公告)日：2020-02-04

    申请号：US15807343

    申请日：2017-11-08

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Kanth Kurumaddali ,  Kenneth Charles Boman ,  David John Huston ,  Han Li

    IPC: H05K5/02 ,  H05K3/30 ,  H05K5/00 ,  H05K13/08 ,  H05K13/00

    Abstract: An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

    Black body radiation in a computing device
    8.
    发明授权
    Black body radiation in a computing device 有权

    公开(公告)号：US10429908B2

    公开(公告)日：2019-10-01

    申请号：US15083285

    申请日：2016-03-28

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Andrew Douglas Delano ,  Aaron Albert Oro ,  Kanth Kurumaddali

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16 ,  H01L23/427 ,  H01L23/467

    Abstract: Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.

    Threaded circuit board
    9.
    发明授权
    Threaded circuit board 有权

    公开(公告)号：US10224660B2

    公开(公告)日：2019-03-05

    申请号：US15296967

    申请日：2016-10-18

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： Kanth Kurumaddali

    IPC: H01R13/62 ,  H01R13/24 ,  H01R4/30 ,  H01R12/70

    Abstract: A circuit board disclosed herein includes a threaded receptor, one or more alignment holes, and one or more pads. The threaded receptor is configured to receive a component with a threaded screw. Each of the one or more alignment holes are configured to receive an alignment pin located on the component. Each of the one or more pads are configured to electrically connect to a pogo pin on the component.

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