公开(公告)号：US12069845B2

公开(公告)日：2024-08-20

申请号：US17660789

申请日：2022-04-26

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jaejin Lee ,  Bo Dan ,  Han Li

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K9/0088 ,  H05K1/0216 ,  H05K3/284 ,  H05K2203/1322

Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

公开(公告)号：US11836013B2

公开(公告)日：2023-12-05

申请号：US17761906

申请日：2020-09-18

Applicant: Microsoft Technology Licensing, LLC

Inventor： Han Li ,  Masaaki Fukumoto ,  Nathan Michael Thome ,  James David Holbery ,  Paul Christopher Kos

IPC: G06F1/16

CPC classification number: G06F1/1677 ,  G06F1/1679 ,  G06F1/1681

Abstract: A method of controlling opening resistance in an electronic device includes maintaining the electronic device in a closed state via a resistive force, wherein the resistive force is applied by at least one of: a hinge of the electronic device, and magnets of the electronic device. The method further includes using a sensor on an underside of the electronic device to detect a force applied to a first portion of the electronic device and determining that the force corresponds to a user initiating opening of the electronic device. In accordance with the determination, the method further includes reducing the resistive force to assist the user in opening the electronic device.

公开(公告)号：US11449108B2

公开(公告)日：2022-09-20

申请号：US16880355

申请日：2020-05-21

Applicant: Microsoft Technology Licensing, LLC

Inventor： Han Li

IPC: G06F1/16

Abstract: The present description relates to flexible hinges and hinged devices. One example device includes a first portion and a second portion. The example also includes a relieved flexible hinge rotatably securing the first and second portions.

公开(公告)号：US11201103B2

公开(公告)日：2021-12-14

申请号：US16428820

申请日：2019-05-31

Applicant: Microsoft Technology Licensing, LLC

Inventor： Lincoln Matthew Ghioni ,  Brian J. Toleno ,  Sahar Vilan ,  Han Li ,  Bo Dan

IPC: H01L23/427 ,  H01L21/48 ,  F28D15/02

Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

公开(公告)号：US20210278882A1

公开(公告)日：2021-09-09

申请号：US16880355

申请日：2020-05-21

Applicant: Microsoft Technology Licensing, LLC

Inventor： Han Li

IPC: G06F1/16

Abstract: The present description relates to flexible hinges and hinged devices. One example device includes a first portion and a second portion. The example also includes a relieved flexible hinge rotatably securing the first and second portions.

公开(公告)号：US10732681B2

公开(公告)日：2020-08-04

申请号：US16046875

申请日：2018-07-26

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bo Dan ,  Robert Ullman Myers ,  James Hao-An Chen Lin ,  Andrew William Hill ,  Han Li

IPC: G05B15/02 ,  G06F1/20 ,  H05K7/20

Abstract: Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.

公开(公告)号：US20200033919A1

公开(公告)日：2020-01-30

申请号：US16046875

申请日：2018-07-26

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bo Dan ,  Robert Ullman Myers ,  James Hao-An Chen Lin ,  Andrew William Hill ,  Han Li

IPC: G06F1/20 ,  H05K7/20 ,  G05B15/02

Abstract: Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.

公开(公告)号：US10369774B2

公开(公告)日：2019-08-06

申请号：US15639581

申请日：2017-06-30

Applicant: Microsoft Technology Licensing, LLC

Inventor： James Michael Bonicatto ,  Han Li ,  David John Huston ,  James David Holbery ,  Siyuan Ma

IPC: B32B43/00 ,  B32B41/00 ,  G06F1/16 ,  G06F3/041 ,  G02F1/1333

Abstract: Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.

公开(公告)号：US11744058B2

公开(公告)日：2023-08-29

申请号：US16856989

申请日：2020-04-23

Applicant: Microsoft Technology Licensing, LLC

Inventor： Zhicong Yao ,  Han Li ,  Scott Douglas Bowers ,  Massood Nikkhah ,  Joseph Benjamin Gault

IPC: H05K9/00 ,  H05K5/00 ,  B29C45/00 ,  B32B5/20 ,  B29K55/02

CPC classification number: H05K9/0081 ,  B29C45/0001 ,  B32B5/20 ,  H05K5/0017 ,  H05K9/002 ,  H05K9/0084 ,  B29K2055/02

Abstract: A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

公开(公告)号：US10555427B2

公开(公告)日：2020-02-04

申请号：US15807343

申请日：2017-11-08

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kanth Kurumaddali ,  Kenneth Charles Boman ,  David John Huston ,  Han Li

IPC: H05K5/02 ,  H05K3/30 ,  H05K5/00 ,  H05K13/08 ,  H05K13/00

Abstract: An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.