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    System for inspecting surface defects of a specimen and a method thereof
    1.
    发明授权
    System for inspecting surface defects of a specimen and a method thereof 有权
    用于检查试样的表面缺陷的系统及其方法

    公开(公告)号：US08643833B1

    公开(公告)日：2014-02-04

    申请号：US13600726

    申请日：2012-08-31

    申请人： Min-Wei Hung ,  Hsin-Yi Tsai ,  Kuo-Cheng Huang ,  Chun-Yao Huang

    发明人： Min-Wei Hung ,  Hsin-Yi Tsai ,  Kuo-Cheng Huang ,  Chun-Yao Huang

    IPC分类号： G01N21/00

    CPC分类号： G01N21/9501

    摘要： An inspection system and method for inspecting the surface defects of the specimen is provided. The inspection system includes a laser focus module, a microscope objective module, an image pick-up module, and a process module. The laser focus module configured to emit laser beam on the specimen by a predetermined angle relative to a surface of the specimen, and to generate scattered light and reflected light when the laser beam irradiates on the surface defects of the specimen. The process module can calculate the real size of the defects by using the intensity information obtained from the image pick-up module and the microscope objective module or using the diameter information obtained from the reflected light image while the reflected light projects on a screen.

    摘要翻译： 提供了一种用于检查样品表面缺陷的检查系统和方法。 检查系统包括激光聚焦模块，显微镜物镜模块，图像拾取模块和处理模块。 所述激光聚焦模块被配置为相对于所述检体的表面在所述试样上发射预定角度的激光束，并且当所述激光束照射在所述试样的表面缺陷上时产生散射光和反射光。 处理模块可以通过使用从图像拾取模块和显微镜物镜模块获得的强度信息或使用从反射光图像获得的直径信息来计算缺陷的实际大小，同时反射光投射在屏幕上。

    Inspection method for inspecting defects of wafer surface
    2.
    发明授权
    Inspection method for inspecting defects of wafer surface 有权
    检查晶圆表面缺陷的检查方法

    公开(公告)号：US08643836B1

    公开(公告)日：2014-02-04

    申请号：US13599479

    申请日：2012-08-30

    申请人： Hsin-Yi Tsai ,  Kuo-Cheng Huang ,  Ya-Cheng Liu ,  Min-Wei Hung

    发明人： Hsin-Yi Tsai ,  Kuo-Cheng Huang ,  Ya-Cheng Liu ,  Min-Wei Hung

    IPC分类号： G01N21/00

    CPC分类号： G01N21/47 ,  G01N21/9501

    摘要： The present invention provides an inspection method for inspecting defects of wafer surface. The method includes: encircling peripheral region of the wafer surface by a first light source set and a second light source set; using a control module to control the first light source set and the second light source set to irradiate the light alternately from different directions; using an image pick-up module to receive a scattered light image during each time when the first light source set or the second light source set irradiates the light on the wafer surface; and then using a process module to obtain an enhanced and clear defect image of wafer surface by processing each of the scattered light images.

    摘要翻译： 本发明提供了一种用于检查晶片表面缺陷的检查方法。 该方法包括：通过第一光源组和第二光源组环绕晶片表面的周边区域; 使用控制模块来控制第一光源组和第二光源组，以从不同方向交替地照射光; 使用图像拾取模块在第一光源组或第二光源组照射晶片表面上的光的每个时间期间接收散射光图像; 然后使用处理模块通过处理每个散射光图像来获得晶片表面的增强和清晰的缺陷图像。