Fin field effect transistor with variable channel thickness for threshold voltage tuning
    1.
    发明授权
    Fin field effect transistor with variable channel thickness for threshold voltage tuning 有权
    具有可变通道厚度的Fin场效应晶体管用于阈值电压调谐

    公开(公告)号:US08513131B2

    公开(公告)日:2013-08-20

    申请号:US13050101

    申请日:2011-03-17

    IPC分类号: H01L21/311

    摘要: A method of forming an integrated circuit (IC) includes forming a first and second plurality of spacers on a substrate, wherein the substrate includes a silicon layer, and wherein the first plurality of spacers have a thickness that is different from a thickness of the second plurality of spacers; and etching the silicon layer in the substrate using the first and second plurality of spacers as a mask, wherein the etched silicon layer forms a first plurality and a second plurality of fin field effect transistor (FINFET) channel regions, and wherein the first plurality of FINFET channel regions each have a respective thickness that corresponds to the thickness of the first plurality of spacers, and wherein the second plurality of FINFET channel regions each have a respective thickness that corresponds to the thickness of the second plurality of spacers.

    摘要翻译: 一种形成集成电路(IC)的方法包括在基板上形成第一和第二多个间隔物,其中所述基板包括硅层,并且其中所述第一多个间隔件的厚度不同于所述第二 多个间隔物; 并且使用所述第一和第二多个间隔物作为掩模来蚀刻所述衬底中的所述硅层,其中所述蚀刻的硅层形成第一多个和第二多个鳍状场效应晶体管(FINFET)沟道区,并且其中所述第一多个 FINFET通道区域各自具有对应于第一多个间隔物的厚度的相应厚度,并且其中第二多个FINFET沟道区域各自具有对应于第二多个间隔物的厚度的相应厚度。

    FIN FIELD EFFECT TRANSISTOR WITH VARIABLE CHANNEL THICKNESS FOR THRESHOLD VOLTAGE TUNING
    2.
    发明申请
    FIN FIELD EFFECT TRANSISTOR WITH VARIABLE CHANNEL THICKNESS FOR THRESHOLD VOLTAGE TUNING 有权
    具有用于阈值电压调谐的可变通道厚度的FIN场效应晶体管

    公开(公告)号:US20120235247A1

    公开(公告)日:2012-09-20

    申请号:US13050101

    申请日:2011-03-17

    IPC分类号: H01L27/088 H01L21/32

    摘要: A method of forming an integrated circuit (IC) includes forming a first and second plurality of spacers on a substrate, wherein the substrate includes a silicon layer, and wherein the first plurality of spacers have a thickness that is different from a thickness of the second plurality of spacers; and etching the silicon layer in the substrate using the first and second plurality of spacers as a mask, wherein the etched silicon layer forms a first plurality and a second plurality of fin field effect transistor (FINFET) channel regions, and wherein the first plurality of FINFET channel regions each have a respective thickness that corresponds to the thickness of the first plurality of spacers, and wherein the second plurality of FINFET channel regions each have a respective thickness that corresponds to the thickness of the second plurality of spacers.

    摘要翻译: 一种形成集成电路(IC)的方法包括在基板上形成第一和第二多个间隔物,其中所述基板包括硅层,并且其中所述第一多个间隔件的厚度不同于所述第二 多个间隔物; 并且使用所述第一和第二多个间隔物作为掩模来蚀刻所述衬底中的所述硅层,其中所述蚀刻的硅层形成第一多个和第二多个鳍状场效应晶体管(FINFET)沟道区,并且其中所述第一多个 FINFET通道区域各自具有对应于第一多个间隔物的厚度的相应厚度,并且其中第二多个FINFET沟道区域各自具有对应于第二多个间隔物的厚度的相应厚度。

    Non-planar MOSFET structures with asymmetric recessed source drains and methods for making the same
    3.
    发明授权
    Non-planar MOSFET structures with asymmetric recessed source drains and methods for making the same 有权
    具有非对称凹陷源漏极的非平面MOSFET结构及其制造方法

    公开(公告)号:US08637371B2

    公开(公告)日:2014-01-28

    申请号:US13398339

    申请日:2012-02-16

    IPC分类号: H01L21/336

    摘要: Non-planar Metal Oxide Field Effect Transistors (MOSFETs) and methods for making non-planar MOSFETs with asymmetric, recessed source and drains having improved extrinsic resistance and fringing capacitance. The methods include a fin-last, replacement gate process to form the non-planar MOSFETs and employ a retrograde metal lift-off process to form the asymmetric source/drain recesses. The lift-off process creates one recess which is off-set from a gate structure while a second recess is aligned with the structure. Thus, source/drain asymmetry is achieved by the physical structure of the source/drains, and not merely by ion implantation. The resulting non-planar device has a first channel of a fin contacting a substantially undoped area on the drain side and a doped area on the source side, thus the first channel is asymmetric. A channel on atop surface of a fin is symmetric because it contacts doped areas on both the drain and source sides.

    摘要翻译: 非平面金属氧化物场效应晶体管(MOSFET)和用于制造具有改进的外在电阻和边缘电容的具有不对称,凹陷源极和漏极的非平面MOSFET的方法。 这些方法包括最后一个替代栅极工艺,以形成非平面MOSFET并且采用逆向金属剥离工艺来形成不对称的源极/漏极凹槽。 剥离过程产生一个从门结构偏离的凹槽,而第二凹槽与结构对准。 因此,源/漏不对称性通过源极/漏极的物理结构实现,而不仅仅是通过离子注入来实现。 所得到的非平面器件具有接触漏极侧的基本上未掺杂的区域和源极侧的掺杂区域的翅片的第一通道,因此第一通道是不对称的。 鳍的顶表面上的通道是对称的,因为它接触漏极和源极侧上的掺杂区域。

    NON-PLANAR MOSFET STRUCTURES WITH ASYMMETRIC RECESSED SOURCE DRAINS AND METHODS FOR MAKING THE SAME
    4.
    发明申请
    NON-PLANAR MOSFET STRUCTURES WITH ASYMMETRIC RECESSED SOURCE DRAINS AND METHODS FOR MAKING THE SAME 有权
    具有不对称吸收源排水的非平面MOSFET结构及其制造方法

    公开(公告)号:US20130214357A1

    公开(公告)日:2013-08-22

    申请号:US13398339

    申请日:2012-02-16

    IPC分类号: H01L29/786 H01L21/336

    摘要: Non-planar Metal Oxide Field Effect Transistors (MOSFETs) and methods for making non-planar MOSFETs with asymmetric, recessed source and drains having improved extrinsic resistance and fringing capacitance. The methods include a fin-last, replacement gate process to form the non-planar MOSFETs and employ a retrograde metal lift-off process to form the asymmetric source/drain recesses. The lift-off process creates one recess which is off-set from a gate structure while a second recess is aligned with the structure. Thus, source/drain asymmetry is achieved by the physical structure of the source/drains, and not merely by ion implantation. The resulting non-planar device has a first channel of a fin contacting a substantially undoped area on the drain side and a doped area on the source side, thus the first channel is asymmetric. A channel on atop surface of a fin is symmetric because it contacts doped areas on both the drain and source sides.

    摘要翻译: 非平面金属氧化物场效应晶体管(MOSFET)和用于制造具有改进的外在电阻和边缘电容的具有不对称,凹陷源极和漏极的非平面MOSFET的方法。 这些方法包括最后一个替代栅极工艺,以形成非平面MOSFET并且采用逆向金属剥离工艺来形成不对称的源极/漏极凹槽。 剥离过程产生一个从门结构偏离的凹槽,而第二凹槽与结构对准。 因此,源/漏不对称性通过源极/漏极的物理结构实现,而不仅仅是通过离子注入来实现。 所得到的非平面器件具有接触漏极侧的基本上未掺杂的区域和源极侧的掺杂区域的翅片的第一通道,因此第一通道是不对称的。 鳍的顶表面上的通道是对称的,因为它接触漏极和源极侧上的掺杂区域。

    Fin Fet device with independent control gate
    5.
    发明授权
    Fin Fet device with independent control gate 有权
    Fin Fet设备具有独立的控制门

    公开(公告)号:US09214529B2

    公开(公告)日:2015-12-15

    申请号:US13047132

    申请日:2011-03-14

    摘要: A FinFET device with an independent control gate, including: a silicon-on-insulator substrate; a non-planar multi-gate transistor disposed on the silicon-on-insulator substrate, the transistor comprising a conducting channel wrapped around a thin silicon fin; a source/drain extension region; an independently addressable control gate that is self-aligned to the fin and does not extend beyond the source/drain extension region, the control gate comprising: a thin layer of silicon nitride; and a plurality of spacers.

    摘要翻译: 一种具有独立控制栅极的FinFET器件,包括:绝缘体上硅衬底; 设置在绝缘体上硅衬底上的非平面多栅极晶体管,所述晶体管包括围绕薄硅片缠绕的导电沟道; 源极/漏极延伸区域; 独立可寻址的控制栅极,其与所述鳍片自对准并且不延伸超过所述源极/漏极延伸区域,所述控制栅极包括:氮化硅薄层; 和多个间隔件。

    FACETED EPI SHAPE AND HALF-WRAP AROUND SILICIDE IN S/D MERGED FINFET
    6.
    发明申请
    FACETED EPI SHAPE AND HALF-WRAP AROUND SILICIDE IN S/D MERGED FINFET 有权
    S / D合并FINFET中的硅化物表面形状和厚度

    公开(公告)号:US20110298058A1

    公开(公告)日:2011-12-08

    申请号:US12794151

    申请日:2010-06-04

    IPC分类号: H01L27/085 H01L21/70

    CPC分类号: H01L29/7853 H01L29/66795

    摘要: FinFETs and methods of making. FinFETs are provided. The FinFET contains two or more fins over a semiconductor substrate; two or more epitaxial layers over side surfaces of the fins; and metal-semiconductor compounds over an upper surfaces of the epitaxial layers. The fin has side surfaces that are substantially vertical relative to the upper surface of the semiconductor substrate. The epitaxial layer has an upper surface that extends at an oblique angle with respect to the side surface of the fin. The FinFET can contain a contact over the metal-semiconductor compounds.

    摘要翻译: FinFET和制作方法。 提供FinFET。 FinFET在半导体衬底上包含两个或更多个鳍; 在翅片的侧表面上的两个或更多个外延层; 和在外延层的上表面上的金属 - 半导体化合物。 翅片具有相对于半导体衬底的上表面基本垂直的侧表面。 外延层具有相对于鳍的侧表面以倾斜角度延伸的上表面。 FinFET可以包含金属 - 半导体化合物上的接触。

    Faceted EPI shape and half-wrap around silicide in S/D merged FinFET
    7.
    发明授权
    Faceted EPI shape and half-wrap around silicide in S/D merged FinFET 有权
    在S / D合并的FinFET中,分段EPI形状和半环绕硅化物

    公开(公告)号:US08362574B2

    公开(公告)日:2013-01-29

    申请号:US12794151

    申请日:2010-06-04

    IPC分类号: H01L27/085 H01L21/70

    CPC分类号: H01L29/7853 H01L29/66795

    摘要: FinFETs and methods of making FinFETs are provided. The FinFET contains two or more fins over a semiconductor substrate; two or more epitaxial layers over side surfaces of the fins; and metal-semiconductor compounds over an upper surfaces of the epitaxial layers. The fin has side surfaces that are substantially vertical relative to the upper surface of the semiconductor substrate. The epitaxial layer has an upper surface that extends at an oblique angle with respect to the side surface of the fin. The FinFET can contain a contact over the metal-semiconductor compounds.

    摘要翻译: 提供FinFET和制造FinFET的方法。 FinFET在半导体衬底上包含两个或更多个鳍; 在翅片的侧表面上的两个或更多个外延层; 和在外延层的上表面上的金属 - 半导体化合物。 翅片具有相对于半导体衬底的上表面基本垂直的侧表面。 外延层具有相对于鳍的侧表面以倾斜角度延伸的上表面。 FinFET可以包含金属 - 半导体化合物上的接触。

    FIN FET DEVICE WITH INDEPENDENT CONTROL GATE
    8.
    发明申请
    FIN FET DEVICE WITH INDEPENDENT CONTROL GATE 有权
    具有独立控制门的FIN FET器件

    公开(公告)号:US20120235234A1

    公开(公告)日:2012-09-20

    申请号:US13047132

    申请日:2011-03-14

    摘要: A FinFET device with an independent control gate, including: a silicon-on-insulator substrate; a non-planar multi-gate transistor disposed on the silicon-on-insulator substrate, the transistor comprising a conducting channel wrapped around a thin silicon fin; a source/drain extension region; an independently addressable control gate that is self-aligned to the fin and does not extend beyond the source/drain extension region, the control gate comprising: a thin layer of silicon nitride; and a plurality of spacers.

    摘要翻译: 一种具有独立控制栅极的FinFET器件,包括:绝缘体上硅衬底; 设置在绝缘体上硅衬底上的非平面多栅极晶体管,所述晶体管包括围绕薄硅片缠绕的导电沟道; 源极/漏极延伸区域; 独立可寻址的控制栅极,其与所述鳍片自对准并且不延伸超过所述源极/漏极延伸区域,所述控制栅极包括:氮化硅薄层; 和多个间隔件。