ELECTROPLATING APPARATUS
    1.
    发明申请

    公开(公告)号:US20190093252A1

    公开(公告)日:2019-03-28

    申请号:US16032522

    申请日:2018-07-11

    Abstract: An apparatus for electroplating which is applicable to the electroplating of workpiece is disclosed. The apparatus includes: an electroplating solution container, a target, an absorbent piece, and a power supply. All the electroplating solution, workpiece, absorbent piece, and target are placed inside the electroplating solution container with at least partial portions of each workpiece, absorbent piece and target submerged in the electroplating solution. The positive electrode of the power supply is electrically connected to the target while its negative electrode is electrically connected to the workpiece and absorbent piece simultaneously. When the power supply imposes a current through the circuit, the target releases metal ions into the electroplating solution and metal ions reduce and a metal coating is formed on the workpiece. In the meantime, carbocations in the electroplating solution are adsorbed on the absorbent piece.

    MANUFACTURING METHOD OF TITANIUM DIOXIDE SOLUTION AND TITANIUM DIOXIDE FILM

    公开(公告)号:US20220281755A1

    公开(公告)日:2022-09-08

    申请号:US17535596

    申请日:2021-11-25

    Abstract: The present disclosure provides a manufacturing method of a titanium dioxide solution and a titanium dioxide film. The manufacturing method of the titanium dioxide solution includes: mixing choline chloride, urea, boric acid, and titanium tetrachloride to form a first solution, wherein a molar concentration ratio of choline chloride to urea is 1:2, a molar concentration of titanium tetrachloride is 0.2 M to 0.4 M, and weight/volume of boric acid is 5 g/300 ml to 15 g/300 ml; and heating the first solution to form a second solution, wherein the second solution contains carbon/nitrogen doped titanium dioxide. In the manufacturing method of the present disclosure, the deep eutectic solution formed by choline chloride and urea may be used as a solvent, and may also be used as a carbon source and/or a nitrogen source. Therefore, titanium dioxide may be doped with carbon and/or nitrogen during the formation process.

    MANUFACTURING METHOD OF INDIUM TIN OXIDE

    公开(公告)号:US20220090285A1

    公开(公告)日:2022-03-24

    申请号:US17477548

    申请日:2021-09-17

    Abstract: The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.

    MANUFACTURING METHOD OF ALUMINUM NITRIDE

    公开(公告)号:US20220090282A1

    公开(公告)日:2022-03-24

    申请号:US17465877

    申请日:2021-09-03

    Abstract: The present disclosure provides a manufacturing method of aluminum nitride, including: providing an electrolyte including choline chloride, urea, aluminum chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; heating the electrolyte to within 60° C.-95° C.; applying an operating current to electroplate aluminum onto the workpiece; and annealing the aluminum on the workpiece to form aluminum nitride.

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