公开(公告)号：US11549189B1

公开(公告)日：2023-01-10

申请号：US17686433

申请日：2022-03-04

Applicant: Ming Chi University of Technology

Inventor： Kun-Cheng Peng ,  Wei-Chuan Shih ,  Cheng-Rong He ,  Ting-Han Chen ,  Dong-Qing Su ,  Jian-Rong Chen

IPC: C25D3/02 ,  C25D3/04 ,  C25D3/10 ,  C25D3/12 ,  C25D3/22 ,  C25D3/32 ,  C25D3/38 ,  C25D3/54 ,  C25D17/00 ,  C12N1/20

Abstract: The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.