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13 条记录 (耗时 0.031 秒)

    Adhesion Material Structure and Process Method Thereof
    1.
    发明申请
    Adhesion Material Structure and Process Method Thereof 审中-公开
    粘合材料结构及其工艺方法

    公开(公告)号：US20070201203A1

    公开(公告)日：2007-08-30

    申请号：US11307847

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： H05K7/20

    CPC分类号： H01L23/373 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： This invention discloses a process method and structure for an adhesion material. The adhesion material is employed for a heat dissipation device that includes several heat sink fins, a heat dissipation slip and a heat pipe. The heat pipe connects several heat sink fins and a heat dissipation slip by the adhesion material. The metal is combed with a bracket structure of carbon element, which has high thermal conductivity, so as to improve the heat conduction efficiency; the adhesion material can be made. The corresponding process method for the adhesion material can be made with a mode of process to form melting stuff, including the metal and a bracket structure of carbon element, and then uses a mode of draw to form the adhesion material. The bracket structure of carbon element can be mixed into the metal.

    摘要翻译： 本发明公开了一种粘合材料的加工方法和结构。 粘合材料用于包括多个散热片，散热片和热管的散热装置。 热管通过粘合材料连接多个散热片和散热片。 该金属与碳元素的支架结构相结合，具有高导热性，从而提高导热效率; 可以制造粘合材料。 用于粘合材料的相应工艺方法可以用一种工艺方式制成熔融材料，包括金属和碳元素的支架结构，然后使用拉伸模式形成粘合材料。 碳元素的支架结构可以混入金属中。

    Dissipation Heat Pipe Structure and Manufacturing Method Thereof
    2.
    发明申请
    Dissipation Heat Pipe Structure and Manufacturing Method Thereof 审中-公开
    耗散热管结构及其制造方法

    公开(公告)号：US20070199682A1

    公开(公告)日：2007-08-30

    申请号：US11307845

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： F28D15/00

    CPC分类号： F28D15/046

    摘要： This invention discloses a manufacturing method and the structure for a dissipation heat pipe. The dissipation heat pipe includes a hollow closed pipe, a column, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from the chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and also can be mixed into the metal.

    摘要翻译： 本发明公开了一种散热管的制造方法和结构。 耗散热管包括中空封闭管，柱，一种流体和芯结构。 耗散热管经常用于从芯片传导热量。 散热管可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂在金属表面上，也可以混入金属中。

    Printed Circuit Board Structure and Manufacturing Method Thereof
    3.
    发明申请
    Printed Circuit Board Structure and Manufacturing Method Thereof 有权
    印刷电路板结构及其制造方法

    公开(公告)号：US20060257664A1

    公开(公告)日：2006-11-16

    申请号：US11307854

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： B32B9/00

    CPC分类号： H05K3/28 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0179 ,  H05K2201/0323 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/30

    摘要： This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal and also can be mixed into the metal.

    摘要翻译： 本发明公开了一种印刷电路板的制造方法和结构。 印刷电路板通常用于支持电路中的电子元件并从电子元件传导热量。 印刷电路板结构包括层叠结构。 层叠结构包括导电层和绝缘层。 导电层可以由特殊的导热材料制成，包括金属和碳元素的支架结构。 绝缘层也可以由导热材料制成，结合碳元素的支架结构。 碳元素的支架结构具有高导热性，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂覆在金属的表面上，并且也可以混入金属中。

    Printed circuit board structure and manufacturing method thereof
    4.
    发明授权
    Printed circuit board structure and manufacturing method thereof 有权
    印刷电路板结构及其制造方法

    公开(公告)号：US07504148B2

    公开(公告)日：2009-03-17

    申请号：US11307854

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： B32B3/00 ,  H05K1/09

    CPC分类号： H05K3/28 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0179 ,  H05K2201/0323 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/30

    摘要： This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal and also can be mixed into the metal.

    摘要翻译： 本发明公开了一种印刷电路板的制造方法和结构。 印刷电路板通常用于支持电路中的电子元件并从电子元件传导热量。 印刷电路板结构包括层叠结构。 层叠结构包括导电层和绝缘层。 导电层可以由特殊的导热材料制成，包括金属和碳元素的支架结构。 绝缘层也可以由导热材料制成，结合碳元素的支架结构。 碳元素的支架结构具有高导热性，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂覆在金属的表面上，并且也可以混入金属中。

    Heat Sink Fin Structure and Manufacturing Method Thereof
    5.
    发明申请
    Heat Sink Fin Structure and Manufacturing Method Thereof 审中-公开
    散热鳍片结构及其制造方法

    公开(公告)号：US20070199677A1

    公开(公告)日：2007-08-30

    申请号：US11307834

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： H05K7/20

    CPC分类号： H01L23/373 ,  H01L21/4871 ,  H01L23/3672 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： This invention discloses a manufacturing method and the structure for a heat sink fin. This heat sink fin structure includes an attachment and a plurality of heat sink fins. The plurality of heat sink fins is often used in conducting the waste heat from a chip. The plurality of heat sink fins and the attachment can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a metal surface and can be mixed into the metal.

    摘要翻译： 本发明公开了散热片的制造方法和结构。 该散热鳍片结构包括附件和多个散热片。 多个散热片通常用于从芯片进行废热。 多个散热鳍片和附件可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高热传导效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的托架结构可以涂覆在金属表面上，并可以混入金属中。

    Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method Thereof
    9.
    发明申请
    Chip Heat Dissipation System and Structure of Heat Exchange Device and Manufacturing Method Thereof 审中-公开
    芯片散热系统及热交换器件的结构及其制造方法

    公开(公告)号：US20070201207A1

    公开(公告)日：2007-08-30

    申请号：US11307853

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： H05K7/20

    CPC分类号： H01L23/373 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： This invention discloses a chip heat dissipation system for a chip in heat dissipating and a manufacturing method and a structure of heat dissipation device. The chip heat dissipation system includes a heat dissipation device, a heat exchange device, a pump assembly device and at least two pipes. This heat dissipation device is used for receiving waste heat generate from the chip, then heat exchange device is used for discharging waste heat. Moreover, the heat exchange device is composed of a thermal conduction material, including a metal material and a bracket structure of carbon element. Also, the pipes are used for connecting at least two connection ends of the heat dissipation device and the heat exchange device and then the pump assembly device is used for circulating a fluid between the heat dissipation device and the heat exchange device by the pipes. The bracket structure of carbon element has high thermal conductivity, so as to improve the heat conduction efficiency. The manufacturing method for thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, melting or the other material preparations. The bracket structure of carbon element can be coated on the metal material surface and can also be mixed into the metal material.

    摘要翻译： 本发明公开了一种用于散热芯片的芯片散热系统及散热装置的制造方法和结构。 芯片散热系统包括散热装置，热交换装置，泵组装装置和至少两个管。 该散热装置用于从芯片接收产生的废热，然后使用热交换装置排放废热。 此外，热交换装置由包括金属材料和碳元素的支架结构的导热材料构成。 此外，管道用于连接散热装置和热交换装置的至少两个连接端，然后使用泵组装装置通过管道在散热装置和热交换装置之间循环流体。 碳元素的支架结构具有高导热性，从而提高导热效率。 导热材料的制造方法可以通过化学气相沉积，物理气相沉积，熔化或其它材料制备。 碳元素的支架结构可以涂覆在金属材料表面上，也可以混入金属材料中。

    Dissipation Heat Pipe Structure and Manufacturing Method Thereof
    10.
    发明申请
    Dissipation Heat Pipe Structure and Manufacturing Method Thereof 审中-公开
    耗散热管结构及其制造方法

    公开(公告)号：US20070199681A1

    公开(公告)日：2007-08-30

    申请号：US11307827

    申请日：2006-02-24

    申请人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    发明人： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Ping-Feng Lee ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

    IPC分类号： F28D15/00

    CPC分类号： F28D15/046

    摘要： This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from a chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the heat conduction efficiency. The corresponding manufacturing method for this heat conduction material can be made by chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and can also be mixed into the metal.

    摘要翻译： 本发明公开了一种散热管的制造方法和结构。 该耗散热管包括中空的封闭管，一种流体和油绳结构。 耗散热管经常用于从芯片传导热量。 散热管可以由特殊的导热材料制成，包括具有高导热性的金属和碳元素的支架结构，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂覆在金属表面上，也可以混入金属中。