摘要:
A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.
摘要:
A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.
摘要:
A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.
摘要:
A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.
摘要:
A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.
摘要:
A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.
摘要:
A plastic packaging of MEMS device and a method therefore are provided. The method includes the steps of: provide a carrier having a surface; provide at least one MEMS device having an active surface with a sensitive area and bonding pads thereon and a back surface; proceed a photoresist process to form a sacrificial layer on the sensitive area; bind and electrically connect the MEMS device to the surface of the carrier; form at least one molding compound, to which the upper surface of the sacrificial layer is exposed. Finally, decompose the sacrificial layer by a solvent to expose the MEMS device on the sensitive area, so as to let the sensitive area contact with ambient atmosphere.
摘要:
A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.
摘要:
A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.
摘要:
The eject-lever apparatus of the present invention is arranged in an optical transceiver having a substrate, where the optical transceiver is being received in a housing having a slot arranged therein with the substrate being plugged into the slot, the apparatus comprising: at least a lever having a cam arranged therein, being disposed at the receiving end of the optic fiber of the optical transceiver; and at least a linkage rod, being deposed on a side of the optical transceiver, wherein the lever is actuated to rotate about an axis from a first location thereof to a second position thereof by exerting a force thereon while driving the cam to rotate accordingly for transmitting the force to an end of the linkage rod enabling the linkage rod to exert a force on the housing so as to generate a reacting force acting on the lever and thus cause the optical transceiver to move out to compress an elastic body and be ejected from the slot gradually; finally, the substrate is totally released from the slot for freeing the optical transceiver from the housing while the lever is in the second position, and thereafter, a resilience force generated by the compressed elastic body enables the returning of the lever from the second position to the first position while the lever is lightly moved.