Wafer level sensing package and manufacturing process thereof
    1.
    发明授权
    Wafer level sensing package and manufacturing process thereof 有权
    晶圆级感测封装及其制造工艺

    公开(公告)号:US07915065B2

    公开(公告)日:2011-03-29

    申请号:US12331539

    申请日:2008-12-10

    Abstract: A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

    Abstract translation: 描述了晶片级感测封装及其制造工艺。 该过程包括提供具有感测芯片的晶片,其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分,而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 以及在所述孔中形成导电凸块以电连接到所述导电金属层。

    Resistive-type humidity sensing structure with microbridge and method therefor
    2.
    发明授权
    Resistive-type humidity sensing structure with microbridge and method therefor 有权
    具有微桥的电阻式湿度感测结构及其方法

    公开(公告)号:US07770449B2

    公开(公告)日:2010-08-10

    申请号:US11808660

    申请日:2007-06-12

    CPC classification number: G01N27/048 Y10T29/49101

    Abstract: A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.

    Abstract translation: 具有微桥的电阻型湿度检测结构包括基板,感测部分和两个测量电极。 在基板上分别形成隔离层和桥。 感测部分包括电阻和湿度感测层。 在与电桥相对应的电阻感测层上形成两个测量电极,以将感测部分固定在第一隔离层上,以测量电阻感测层的电阻值。 湿度传感层的材料根据湿度改变其体积,由湿度感测层覆盖的电阻感测层的长度变形,并且电阻感测层的材料长度的变化导致电阻值的变化 。 最后,使用两个测量电极来测量湿度值。

    WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF
    3.
    发明申请
    WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF 有权
    WAFER水平感测包装及其制造工艺

    公开(公告)号:US20090124074A1

    公开(公告)日:2009-05-14

    申请号:US12331539

    申请日:2008-12-10

    Abstract: A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

    Abstract translation: 描述了晶片级感测封装及其制造工艺。 该过程包括提供具有感测芯片的晶片,其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分,而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 并且在所述孔中形成导电凸块以电连接到所述导电金属层。

    Apparatus for sensing plural gases
    4.
    发明授权
    Apparatus for sensing plural gases 有权
    用于感测多种气体的装置

    公开(公告)号:US07508519B2

    公开(公告)日:2009-03-24

    申请号:US11324481

    申请日:2006-01-04

    Abstract: The apparatus for sensing plural gases is substantially a gas sensor adopting planar lightwave circuit for constructing reference optical path and sensing optical path, which is a flat structure with abilities of high accuracy, long-term stability, and short response time. The gas sensor can be widely applied for monitoring the safety of a working environment, securing the safety of workers, alerting potential hazard in a factory, inspecting harmful materials in a specific area, testing leakage of a pipeline, inspecting waste gas exhausted from automobile/motorcycle, and monitoring the living quality of household environment.

    Abstract translation: 用于感测多种气体的装置基本上是采用平面光波电路的气体传感器,用于构建参考光路和感测光路,该光路是具有高精度,长期稳定性和响应时间短的能力的平坦结构。 气体传感器可广泛用于监测工作环境的安全性,确保工人的安全,警惕工厂的潜在危险,检查特定区域的有害物质,检测管道的泄漏,检查汽车/ 摩托车,并监测住户环境的生活质量。

    Diaper
    6.
    发明申请
    Diaper 审中-公开
    尿布

    公开(公告)号:US20080074274A1

    公开(公告)日:2008-03-27

    申请号:US11654559

    申请日:2007-01-18

    CPC classification number: A61F13/42

    Abstract: The present invention provides a diaper including a body, a sensing module disposed on the body for detecting humidity of the body and wirelessly transmitting an electrical signal converted from the humidity and a receiving module for receiving the electrical signal transmitted by the sensing module and generating an alarm signal.

    Abstract translation: 本发明提供了一种尿布,其包括主体,设置在身体上用于检测身体湿度的无线传感器的感测模块,以及从湿度转换的电信号和接收模块,用于接收由感测模块发送的电信号, 报警信号。

    Humidity sensing structure having a cantilever resistor and method for fabricating the same
    7.
    发明申请
    Humidity sensing structure having a cantilever resistor and method for fabricating the same 有权
    具有悬臂电阻的湿度传感结构及其制造方法

    公开(公告)号:US20070188974A1

    公开(公告)日:2007-08-16

    申请号:US11647216

    申请日:2006-12-29

    CPC classification number: H01G5/18 H01C10/14 Y10T29/49099

    Abstract: A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.

    Abstract translation: 公开了一种具有悬臂电阻的湿度检测结构及其制造方法。 该方法包括提供具有第一表面和第二表面的基底; 在所述第一表面和所述第二表面上进行氧化处理以分别形成第一氧化物层和第二氧化物层; 在所述第一氧化物层上形成电阻感测层; 在电阻感测层上形成湿度感测层; 在基板上形成穿透第一氧化物层和第二氧化物层的通孔; 并且在通孔中形成悬臂,使得湿度感测层和电阻感测层都固定在悬臂上的适当位置。 响应于湿度变化,湿度感测层的体积变化,因此电阻感测层的长度变化,允许测量环境湿度。

    Apparatus for sensing plural gases
    8.
    发明申请
    Apparatus for sensing plural gases 有权
    用于感测多种气体的装置

    公开(公告)号:US20070120057A1

    公开(公告)日:2007-05-31

    申请号:US11324481

    申请日:2006-01-04

    Abstract: The apparatus for sensing plural gases is substantially a gas sensor adopting planar lightwave circuit for constructing reference optical path and sensing optical path, which is a flat structure with abilities of high accuracy, long-term stability, and short response time. The gas sensor can be widely applied for monitoring the safety of a working environment, securing the safety of workers, alerting potential hazard in a factory, inspecting harmful materials in a specific area, testing leakage of a pipeline, inspecting waste gas exhausted from automobile/motorcycle, and monitoring the living quality of household environment.

    Abstract translation: 用于感测多种气体的装置基本上是采用平面光波电路的气体传感器,用于构建参考光路和感测光路,该光路是具有高精度,长期稳定性和响应时间短的能力的平坦结构。 气体传感器可广泛用于监测工作环境的安全性,确保工人的安全,警惕工厂的潜在危险,检查特定区域的有害物质,检测管道的泄漏,检查汽车/ 摩托车,并监测住户环境的生活质量。

    Flexible biomonitor with EMI shielding and module expansion
    10.
    发明授权
    Flexible biomonitor with EMI shielding and module expansion 有权
    具有EMI屏蔽和模块扩展的灵活生物医疗器械

    公开(公告)号:US08287451B2

    公开(公告)日:2012-10-16

    申请号:US12138638

    申请日:2008-06-13

    Abstract: A flexible biomonitor comprises: a flexible substrate having a circuit apparatus, a hybrid sensor, a plurality of IC devices, a central processing module, a RF transmitter circuit, an antenna, and a power supply. Thereupon the flexible biomonitor can be plastered on the skin where the human body needs to be monitored to achieve the purposes of reducing occupied area, providing comfortable wear and achieve compactness, module expansion and EMI shielding. Besides, it is capable of remote real-time monitoring this signal to achieve the purpose of home care.

    Abstract translation: 柔性生物体包括:具有电路装置,混合传感器,多个IC器件,中央处理模块,RF发射器电路,天线和电源的柔性基板。 因此,灵活的生物监测器可以涂抹在人体需要监测的皮肤上,以达到减少占用面积的目的,提供舒适的磨损,实现紧凑性,模块扩展和EMI屏蔽。 此外,它能够远程实时监控此信号,以达到家庭护理的目的。

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