Abstract:
A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.
Abstract:
A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.
Abstract:
A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.
Abstract:
The apparatus for sensing plural gases is substantially a gas sensor adopting planar lightwave circuit for constructing reference optical path and sensing optical path, which is a flat structure with abilities of high accuracy, long-term stability, and short response time. The gas sensor can be widely applied for monitoring the safety of a working environment, securing the safety of workers, alerting potential hazard in a factory, inspecting harmful materials in a specific area, testing leakage of a pipeline, inspecting waste gas exhausted from automobile/motorcycle, and monitoring the living quality of household environment.
Abstract:
A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.
Abstract:
The present invention provides a diaper including a body, a sensing module disposed on the body for detecting humidity of the body and wirelessly transmitting an electrical signal converted from the humidity and a receiving module for receiving the electrical signal transmitted by the sensing module and generating an alarm signal.
Abstract:
A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.
Abstract:
The apparatus for sensing plural gases is substantially a gas sensor adopting planar lightwave circuit for constructing reference optical path and sensing optical path, which is a flat structure with abilities of high accuracy, long-term stability, and short response time. The gas sensor can be widely applied for monitoring the safety of a working environment, securing the safety of workers, alerting potential hazard in a factory, inspecting harmful materials in a specific area, testing leakage of a pipeline, inspecting waste gas exhausted from automobile/motorcycle, and monitoring the living quality of household environment.
Abstract:
An encapsulation method of organic electroluminscence device is provided. An organic electroluminescent device is formed on an indium-tin-oxide glass substrate. A metal electrode is formed on the organic electroluminescent device. The organic electroluminescent device is encapsulated by a nitride layer or a carbide layer formed by using segmental sputtering at a low temperature. The substrate is soldered on a metal plate and covered by a metal cap.
Abstract:
A flexible biomonitor comprises: a flexible substrate having a circuit apparatus, a hybrid sensor, a plurality of IC devices, a central processing module, a RF transmitter circuit, an antenna, and a power supply. Thereupon the flexible biomonitor can be plastered on the skin where the human body needs to be monitored to achieve the purposes of reducing occupied area, providing comfortable wear and achieve compactness, module expansion and EMI shielding. Besides, it is capable of remote real-time monitoring this signal to achieve the purpose of home care.