公开(公告)号：US20130161708A1

公开(公告)日：2013-06-27

申请号：US13606447

申请日：2012-09-07

申请人： Ming-Tsan Peng ,  Shih-Tung Cheng ,  Edward Yi Chang ,  Po-Chien Chou ,  Shyr-Long Jeng ,  Chia-Hua Chang ,  Tsung-Lin Chen ,  Jian-Feng Tsai

发明人： Ming-Tsan Peng ,  Shih-Tung Cheng ,  Edward Yi Chang ,  Po-Chien Chou ,  Shyr-Long Jeng ,  Chia-Hua Chang ,  Tsung-Lin Chen ,  Jian-Feng Tsai

IPC分类号： H01L29/78 ,  H01L21/58

CPC分类号： H01L23/42 ,  H01L23/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29139 ,  H01L2224/321 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/3318 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a substrate, a die and a medium. The substrate has an upper substrate surface. The substrate has a trench extended downward from the upper substrate surface. The trench has a side trench surface. The die is in the trench. The die has a lower die surface and a side die surface. The lower die surface is below the upper substrate surface. A part of the trench between the side trench surface and the side die surface is filled with the medium.

摘要翻译： 提供半导体结构及其制造方法。 半导体结构包括基板，管芯和介质。 基板具有上基板表面。 衬底具有从上衬底表面向下延伸的沟槽。 沟槽具有侧沟槽表面。 死在沟里。 模具具有下模表面和侧模表面。 下模表面在上基板表面下方。 侧沟槽表面和侧模表面之间的沟槽的一部分填充有介质。

公开(公告)号：US08370865B2

公开(公告)日：2013-02-05

申请号：US12789437

申请日：2010-05-27

申请人： Shih-Tung Cheng ,  Po-Chien Chou ,  Yu-Cheng Lin

发明人： Shih-Tung Cheng ,  Po-Chien Chou ,  Yu-Cheng Lin

IPC分类号： G11B17/028 ,  G11B15/52

CPC分类号： G11B21/12 ,  G11B7/08576 ,  G11B21/16

摘要： A sensing device including a base, a pillar, an arm, a sensing element and a driving module is provided. The base has a supporting surface suitable for supporting the object. The pillar is disposed on the supporting surface. The arm has two ends and a pivot portion between the two ends. The pivot position is pivoted to the pillar along an axis substantially parallel to the supporting surface. The sensing element is disposed on the arm and located between an end and the pivot portion. The sensing element is located between the base and the object. The driving module is disposed between the arm and the base. The driving module drives the arm to pivot relatively to the pillar along the axis, and the sensing element moves toward or away from the object as the arm is pivoted.

摘要翻译： 提供了包括基座，支柱，臂，感测元件和驱动模块的感测装置。 基座具有适于支撑物体的支撑表面。 支柱设置在支撑面上。 臂具有两端和两端之间的枢轴部分。 枢转位置沿着基本上平行于支撑表面的轴线枢转到支柱。 感测元件设置在臂上并且位于端部和枢转部分之间。 感测元件位于基座和物体之间。 驱动模块设置在臂和基座之间。 驱动模块驱动臂沿着轴线相对于支柱枢转，并且当臂枢转时，感测元件朝向或远离物体移动。

公开(公告)号：US20110273975A1

公开(公告)日：2011-11-10

申请号：US12789437

申请日：2010-05-27

申请人： Shih-Tung Cheng ,  Po-Chien Chou ,  Yu-Cheng Lin

发明人： Shih-Tung Cheng ,  Po-Chien Chou ,  Yu-Cheng Lin

IPC分类号： G11B15/52

CPC分类号： G11B21/12 ,  G11B7/08576 ,  G11B21/16

摘要： A sensing device including a base, a pillar, an arm, a sensing element and a driving module is provided. The base has a supporting surface suitable for supporting the object. The pillar is disposed on the supporting surface. The arm has two ends and a pivot portion between the two ends. The pivot position is pivoted to the pillar along an axis substantially parallel to the supporting surface. The sensing element is disposed on the arm and located between an end and the pivot portion. The sensing element is located between the base and the object. The driving module is disposed between the arm and the base. The driving module drives the arm to pivot relatively to the pillar along the axis, and the sensing element moves toward or away from the object as the arm is pivoted.

摘要翻译： 提供了包括基座，支柱，臂，感测元件和驱动模块的感测装置。 基座具有适于支撑物体的支撑表面。 支柱设置在支撑面上。 臂具有两端和两端之间的枢轴部分。 枢转位置沿着基本上平行于支撑表面的轴线枢转到支柱。 感测元件设置在臂上并且位于端部和枢转部分之间。 感测元件位于基座和物体之间。 驱动模块设置在臂和基座之间。 驱动模块驱动臂沿着轴线相对于支柱枢转，并且当臂枢转时，感测元件朝向或远离物体移动。