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    Curable compositions and related methods
    1.
    发明授权
    Curable compositions and related methods 有权

    公开(公告)号：US11370908B2

    公开(公告)日：2022-06-28

    申请号：US17052430

    申请日：2019-06-25

    申请人： 3M INNOVATIVE PROPERTIES COMPANY

    发明人： Lianzhou Chen ,  Dmitriy Salnikov

    IPC分类号： C08L63/00 ,  C09J7/35 ,  C08G59/24 ,  C08G59/38 ,  C08G59/50 ,  C08G59/60 ,  C08G75/029 ,  C08K3/08 ,  C08K5/18 ,  C08L81/06 ,  C08G59/40

    摘要： Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.

    Epoxy resin reactive diluent compositions
    6.
    发明授权
    Epoxy resin reactive diluent compositions 有权
    环氧树脂反应性稀释剂组合物

    公开(公告)号：US08318834B2

    公开(公告)日：2012-11-27

    申请号：US12988874

    申请日：2009-05-04

    申请人： Robert E. Hefner, Jr. ,  John W. Hull, Jr. ,  James W. Ringer ,  John N. Argyropoulos

    发明人： Robert E. Hefner, Jr. ,  John W. Hull, Jr. ,  James W. Ringer ,  John N. Argyropoulos

    IPC分类号： C08G59/60

    CPC分类号： C09D163/00 ,  C08G59/226 ,  C08G59/38 ,  C08L63/00

    摘要： An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.

    摘要翻译： 环氧树脂反应性稀释剂组合物包含环氧树脂稀释剂（A）和树脂化合物（B），其中环氧树脂稀释剂（A）包含顺式，反式-1,3-和-1,4-环己烷二甲醚部分; 并且其中所述树脂化合物（B）包含除环氧树脂稀释剂（A）以外的一种或多种环氧树脂。 因此，可固化环氧树脂组合物包含环氧树脂反应性稀释剂组合物和固化剂和/或固化催化剂。 通过固化可固化环氧树脂组合物制备固化的环氧树脂。

    Hardenable epoxide resin mixtures containing cyanolactams
    8.
    发明授权
    Hardenable epoxide resin mixtures containing cyanolactams 失效
    包含胞内酰胺的可硬化环氧树脂混合物

    公开(公告)号：US4384084A

    公开(公告)日：1983-05-17

    申请号：US347402

    申请日：1982-02-10

    申请人： Friedrich Lohse ,  Dieter Trachsler ,  Roland Moser

    发明人： Friedrich Lohse ,  Dieter Trachsler ,  Roland Moser

    IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G59/44 ,  C08G59/60

    CPC分类号： C08G59/448 ,  C08G59/4014

    摘要： Hardenable mixtures which contain a polyepoxide compound with, on average, more than one epoxide group in the molecule, and a hardener of the formula I ##STR1## The symbol n is an integer from 3 to 5. The methylene carbon atoms can be substituted by one or two methyl or ethyl groups.The hardenable mixtures can be used, for example, in the fields of the protection of surfaces or of adhesives technology.

    摘要翻译： 含有分子中平均具有多于一个环氧基团的聚环氧化物化合物的硬化混合物和式I的固化剂（I）符号n为3至5的整数。亚甲基碳原子可以 被一个或两个甲基或乙基取代。 可硬化混合物可用于例如表面保护或粘合剂技术领域。

    CURABLE COMPOSITIONS AND RELATED METHODS
    9.
    发明申请
    CURABLE COMPOSITIONS AND RELATED METHODS 有权

    公开(公告)号：US20210102061A1

    公开(公告)日：2021-04-08

    申请号：US17052430

    申请日：2019-06-25

    申请人： 3M INNOVATIVE PROPERTIES COMPANY

    发明人： Lianzhou CHEN ,  Dmitriy SALNIKOV

    IPC分类号： C08L63/00 ,  C08L81/06 ,  C08G75/029 ,  C08G59/38 ,  C08G59/24 ,  C08G59/50 ,  C08G59/60 ,  C08K3/08 ,  C09J7/35 ,  C08K5/18

    摘要： Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.

    Prepregs and production of composite material using prepregs
    10.
    发明授权
    Prepregs and production of composite material using prepregs 有权

    公开(公告)号：US10913833B2

    公开(公告)日：2021-02-09

    申请号：US15756721

    申请日：2016-09-05

    申请人： Gurit (UK) Ltd.

    发明人： Paul Spencer ,  Laura Jane Slade

    IPC分类号： C08J5/24 ,  C08G59/40 ,  C08G59/68 ,  C08G59/50 ,  B29C70/34 ,  C08G59/60 ,  B29K63/00 ,  B29K105/08 ,  B29K307/04

    摘要： A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.