Semiconductor device comprising a buffer layer including a complex defect of interstice carbon and interstice oxygen

    公开(公告)号:US11799022B2

    公开(公告)日:2023-10-24

    申请号:US17242587

    申请日:2021-04-28

    摘要: A semiconductor device includes: a drift layer of a first conduction type provided in a semiconductor substrate having a first principal plane and a second principal plane opposed to the first principal plane; a first semiconductor layer of a second conduction type provided between the first principal plane of the semiconductor substrate and the drift layer and having impurity concentration higher than impurity concentration of the drift layer; a first buffer layer of a first conduction type provided between the second principal plane of the semiconductor substrate and the drift layer and having hydrogen-induced donors with impurity concentration higher than impurity concentration of the drift layer; and a second semiconductor layer of a first conduction type or a second conduction type provided between the second principal plane of the semiconductor substrate and the first buffer layer and having impurity concentration higher than impurity concentration of the drift layer, wherein the first buffer layer includes a complex defect of interstice carbon and interstice oxygen having density decreasing from the second principal plane side toward the first principal plane side.

    Semiconductor device and manufacturing method thereof

    公开(公告)号:US11101133B2

    公开(公告)日:2021-08-24

    申请号:US16448225

    申请日:2019-06-21

    发明人: Katsumi Nakamura

    摘要: An object of the present invention is to provide stable withstand voltage characteristics, reduce turn-off losses along with a reduction in leakage current when the device is off, improve controllability of turn-off operations, and improve blocking capability at turn-off. An N buffer layer includes a first buffer layer joined to an active layer and having one peak in impurity concentration, and a second buffer layer joined to the first buffer layer and an N− drift layer, having at least one peak point in impurity concentration, and having a lower maximum impurity concentration than the first buffer layer. The impurity concentration at the peak point of the first buffer layer is higher than the impurity concentration of the N− drift layer, and the impurity concentration of the second buffer layer is higher than the impurity concentration of the N− drift layer in the entire area of the second buffer layer.

    Semiconductor device, power conversion device, and method of manufacturing semiconductor device

    公开(公告)号:US10026803B1

    公开(公告)日:2018-07-17

    申请号:US15666096

    申请日:2017-08-01

    发明人: Katsumi Nakamura

    摘要: The present invention has an object of, in a semiconductor device having a vertical structure, providing stable withstand voltage characteristics, reducing a turn-off loss with reduction in leakage current at a time of turn-off, and improving a controllability of a turn-off operation and a blocking capability at a time of turn-off.A buffer layer includes a first buffer layer being joined to an active layer and having one peak point of an impurity concentration and a second buffer layer being joined to the first buffer layer and a drift layer, having at least one peak point of an impurity concentration, and having a maximum impurity concentration lower than that of the first buffer layer, and the maximum impurity concentration of the second buffer layer is higher than the impurity concentration of the drift layer and equal to or lower than 1.0×1015 cm−3.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    7.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20140327072A1

    公开(公告)日:2014-11-06

    申请号:US14336800

    申请日:2014-07-21

    IPC分类号: H01L29/861

    摘要: A semiconductor device includes: an N-type drift layer; a P-type anode layer on the N-type drift layer; a trench penetrating the P-type anode layer; a conductive substance embedded in the trench via an insulating film; and an N-type buffer layer between the N-type drift layer and the P-type anode layer and having impurity concentration which is higher than that of the N-type drift layer.

    摘要翻译: 一种半导体器件包括:N型漂移层; N型漂移层上的P型阳极层; 穿透P型阳极层的沟槽; 通过绝缘膜嵌入沟槽中的导电物质; 以及在N型漂移层和P型阳极层之间的N型缓冲层,其杂质浓度高于N型漂移层的杂质浓度。

    Semiconductor device and method of manufacturing semiconductor device

    公开(公告)号:US11949007B2

    公开(公告)日:2024-04-02

    申请号:US17405451

    申请日:2021-08-18

    发明人: Katsumi Nakamura

    摘要: A semiconductor device includes: an N− drift layer of a first conductivity type formed in the semiconductor substrate; a P base layer formed on the N− drift layer; and an N buffer layer of the first conductivity type formed under the N− drift layer and higher in peak impurity concentration than the N− drift layer. The N buffer layer includes: a first buffer layer in which a trap level derived from lattice defect is not detected by a photoluminescence method; and a second buffer layer provided between the first buffer layer and the N− drift layer and in which two types of trap levels derived from lattice defect are detected by the photoluminescence method.

    Semiconductor device including first and second buffer layers

    公开(公告)号:US11444157B2

    公开(公告)日:2022-09-13

    申请号:US17069990

    申请日:2020-10-14

    摘要: An object is to provide a technique of improving productivity of a semiconductor device. A first buffer layer includes a first portion located in a thickness direction of a semiconductor substrate from a main surface and having a first peak of an N type impurity concentration and a second portion located farther away from the main surface than the first portion and having a second peak of an N type impurity concentration. A distance from the main surface to the first portion is equal to or smaller than 4.0 μm, and a distance from the first portion to the second portion is equal to or larger than 14.5 μm. An N type impurity concentration of a portion between the first portion and the second portion is higher than an N type impurity concentration of a drift layer.