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公开(公告)号：US10651720B2
公开(公告)日：2020-05-12
申请号：US16087666
申请日：2016-05-25
摘要： An object of the present invention is to synchronize PWM between individual phases of an IPM, so that the IPM has a simplified-scale circuit. An IPM according to the present invention includes a DC-DC converter including a multi-phase arm having a plurality of phase arms connected in parallel on a secondary side, a secondary-wire-voltage detection circuit configured to detect a secondary wire voltage in each phase arm of the DC-DC converter, and a synchronization-signal generation circuit configured to generate a synchronization signal in each phase arm on the basis of the behavior of the secondary wire voltage.
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公开(公告)号：US12074088B2
公开(公告)日：2024-08-27
申请号：US17418507
申请日：2019-03-15
发明人： Takahiko Murakami
CPC分类号： H01L23/4006 , H01L23/293
摘要： A semiconductor device includes a base plate, a case, and a collar. The base plate includes a metal or an alloy. The base plate has a first bolt hole. The case includes a resin. The case has a first main surface and a second main surface. The second main surface is in contact with the base plate. The case has a through-hole. The collar includes a metal or an alloy. The collar is located within the through-hole. The collar has a first end and a second end. The first end is located on a side where the first main surface is located. The second end is located on a side where the second main surface is located. The collar has a second bolt hole. The first end has a flange. Alternatively, the collar has an outer circumferential surface. The outer circumferential surface has a straight knurling.
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公开(公告)号：US11831216B2
公开(公告)日：2023-11-28
申请号：US17620748
申请日：2019-08-27
CPC分类号： H02K41/031 , B65G54/02 , H02K41/03 , H02K41/02
摘要： A linear motor system includes: a mover including permanent magnets arranged in a traveling direction in a plane parallel to a plane formed by the traveling direction and a vertical direction; and a stator including an armature including an iron core in which projections around which windings are wound are arranged in the traveling direction, the armature being disposed to face the permanent magnets of the mover. The mover includes a mover body including a first main roller engaged with a first traveling surface disposed on the stator, a placing table on which a conveyance object is placed, and a sub-roller engaged with a second traveling surface disposed on an upper surface of the stator. The first main roller supports a magnetic attraction force generated between the stator and the mover, and the sub-roller supports a force in a direction opposite the magnetic attraction force acting on the mover.
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公开(公告)号：US10304748B2
公开(公告)日：2019-05-28
申请号：US15561076
申请日：2015-07-27
摘要： An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.
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公开(公告)号：US11270929B2
公开(公告)日：2022-03-08
申请号：US16755488
申请日：2018-01-05
发明人： Naohiro Oogushi , Ryoji Murai , Takahiko Murakami
IPC分类号： H01L23/495 , H01L21/66 , H01L23/36 , H01L25/04
摘要： A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.
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公开(公告)号：US11063004B2
公开(公告)日：2021-07-13
申请号：US16348513
申请日：2016-11-29
发明人： Takahiko Murakami , Arata Iizuka , Ryoji Murai , Katsuji Ando
IPC分类号： H01L23/495 , H01L23/00 , H02K11/33 , H01L21/48 , H01L21/56 , H01L23/047 , H01L23/31 , H01L25/07 , H01L25/00 , H02K11/00
摘要： An object of the present invention is to provide a semiconductor device capable of reducing external stress transmitted to a semiconductor chip through a lead frame. A semiconductor device includes a base plate, a semiconductor element held on the base plate, a housing disposed on the base plate and having a frame shape enclosing the semiconductor element, a terminal section provided in an outer surface of the housing and connectable to an external device, a lead frame that is long and has one end disposed so as to be connectable to the terminal section provided in the housing and another end connected onto the semiconductor element via a bonding material, a sealing material disposed in the housing to seal the lead frame and the semiconductor element, and a fixing section that fixes, in the housing, part of the lead frame to the base plate or the housing.
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公开(公告)号：US10916483B2
公开(公告)日：2021-02-09
申请号：US16391815
申请日：2019-04-23
摘要： An object of the present invention is to provide a semiconductor device having a structure in which a resin hardly enters between an insert electrode and a nut at a time of resin sealing. The semiconductor device according to the present invention includes an insert electrode having an insert hole into which a bolt is inserted from outside, a nut which has a screw hole to be screwed with the bolt and is disposed on an inside of the insert electrode so that the screw hole is communicated with the insert hole, at least one semiconductor element being electrically connected to the insert electrode, and a resin sealing the inside of the insert electrode, the nut, and the at least one semiconductor element, wherein a burr is provided on an outer periphery of a direct contact surface of the nut being in direct contact with the insert electrode.
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