公开(公告)号：US20180159008A1

公开(公告)日：2018-06-07

申请号：US15572522

申请日：2016-05-13

Applicant: Momentive Performance Materials Inc.

Inventor： Wei Fan ,  Eelco Galestien ,  Creighton Tomek ,  Manjunath Subbanna

IPC: H01L33/64 ,  F21S41/141 ,  F21S45/48

CPC classification number: H01L33/641 ,  F21S41/141 ,  F21S41/148 ,  F21S45/47 ,  F21V29/87 ,  F21Y2101/00 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L23/373 ,  H01L33/642 ,  H01L33/648

Abstract: A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.

公开(公告)号：US10403806B2

公开(公告)日：2019-09-03

申请号：US15572522

申请日：2016-05-13

Applicant: Momentive Performance Materials Inc.

Inventor： Wei Fan ,  Eelco Galestien ,  Creighton Tomek ,  Manjunath Subbanna

IPC: H01L33/64 ,  H01L23/373 ,  F21V29/87 ,  F21S41/141 ,  F21S45/47 ,  F21S41/148 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y107/90

Abstract: A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.