Semiconductor device and method for fabricating the same
    1.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US09337057B2

    公开(公告)日:2016-05-10

    申请号:US14802467

    申请日:2015-07-17

    摘要: Provided are methods for fabricating semiconductor devices. The methods for fabricating the semiconductor devices may include forming a first interlayer insulation film including a trench on a substrate, forming a high-k layer along an inner sidewall and a bottom surface of the trench, forming a first work function control film including impurities along the high-k layer, removing the impurities from the first work function control film to reduce surface resistance of the first work function control film by about 30% to about 60% and forming a gate metal in the trench.

    摘要翻译: 提供制造半导体器件的方法。 制造半导体器件的方法可以包括在衬底上形成包括沟槽的第一层间绝缘膜,沿着沟槽的内侧壁和底表面形成高k层,形成包含杂质的第一功函数控制膜 高k层,从第一功函数控制膜去除杂质,以使第一功函数控制膜的表面电阻降低约30%至约60%,并在沟槽中形成栅极金属。