公开(公告)号：US08787950B2

公开(公告)日：2014-07-22

申请号：US13011123

申请日：2011-01-21

Applicant: Won Kyoung Choi

Inventor： Won Kyoung Choi

IPC: H04W4/12

CPC classification number: H04W4/12 ,  H04L45/16 ,  H04L51/14 ,  H04L51/38 ,  H04W40/00

Abstract: A mobile terminal and a method for transmitting a message thereof are provided. The method for transmitting a message in a mobile terminal including at least two communication units capable of communicating with different communication networks, includes, identifying circuits connected through the at least two communication units when at least two identification information of other mobile terminals to which the message is to be transmitted is input, and simultaneously transmitting the message to the at least two other mobile terminals according to the identification information through the identified circuits. Through the method, a message can be simultaneously transmitted to a plurality of other mobile terminals using characteristics of a multi-standby mobile terminal. In addition, the message transmission method can reduce a time required to transmit a message.

Abstract translation: 提供了一种用于发送其消息的移动终端和方法。 用于在包括能够与不同通信网络进行通信的至少两个通信单元的移动终端中发送消息的方法包括：当至少两个通信单元的至少两个识别信息与其中的消息 要被发送，并且通过所识别的电路根据识别信息同时将消息发送到至少两个其他移动终端。 通过该方法，可以使用多待机移动终端的特性将消息同时发送到多个其他移动终端。 此外，消息发送方法可以减少发送消息所需的时间。

公开(公告)号：US08587120B2

公开(公告)日：2013-11-19

申请号：US13167487

申请日：2011-06-23

Applicant: Won Kyoung Choi ,  Pandi Chelvam Marimuthu

Inventor： Won Kyoung Choi ,  Pandi Chelvam Marimuthu

IPC: H01L23/485

CPC classification number: H01L24/13 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/11 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11822 ,  H01L2224/11906 ,  H01L2224/13 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device has a semiconductor die with a first conductive layer formed over the die. A first insulating layer is formed over the die with a first opening in the first insulating layer disposed over the first conductive layer. A second conductive layer is formed over the first insulating layer and into the first opening over the first conductive layer. An interconnect structure is constructed by forming a second insulating layer over the first insulating layer with a second opening having a width less than the first opening and depositing a conductive material into the second opening. The interconnect structure can be a conductive pillar or conductive pad. The interconnect structure has a width less than a width of the first opening. The second conductive layer over the first insulating layer outside the first opening is removed while leaving the second conductive layer under the interconnect structure.

公开(公告)号：US08517249B2

公开(公告)日：2013-08-27

申请号：US11872066

申请日：2007-10-15

Applicant: Won-kyoung Choi ,  Chang-youl Moon ,  Yoon-chul Son ,  Young-ho Kim ,  Hee-ra Roh ,  Chang-yul Oh

Inventor： Won-kyoung Choi ,  Chang-youl Moon ,  Yoon-chul Son ,  Young-ho Kim ,  Hee-ra Roh ,  Chang-yul Oh

IPC: B23K35/14

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K35/282 ,  B23K2101/42 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/0501 ,  H01L2224/05011 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/1134 ,  H05K3/244 ,  H05K3/3463 ,  Y10T428/12493 ,  H01L2924/00014 ,  H01L2924/0103 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01047

Abstract: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.

Abstract translation: 使用Zn的焊接结构包括含有Zn的结合层; 以及与接合层结合并反应的无铅焊料。 接合层可以是Zn合金层或包含Zn层的多层。 因此，可以通过将高反应性Zn引入焊接的界面反应来提高焊接结构的特性。

公开(公告)号：US08435881B2

公开(公告)日：2013-05-07

申请号：US13167566

申请日：2011-06-23

Applicant: Won Kyoung Choi ,  Pandi Chelvam Marimuthu

Inventor： Won Kyoung Choi ,  Pandi Chelvam Marimuthu

IPC: H01L21/283

CPC classification number: H01L23/564 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11822 ,  H01L2224/11902 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A semiconductor device has a semiconductor die with a first conductive layer formed over the semiconductor die. A first insulating layer is formed over the semiconductor die with a first opening in the first insulating layer disposed over the first conductive layer. A second conductive layer is formed over the first insulating layer and into the first opening over the first conductive layer. An interconnect structure is formed over the first and second conductive layers within openings of a second insulating layer. The second insulating layer is removed. The interconnect structure can be a conductive pillar or conductive pad. A bump material can be formed over the conductive pillar. A protective coating is formed over the conductive pillar or pad to a thickness less than one micrometer to reduce oxidation. The protective coating is formed by immersing the conductive pillar or pad into the bath containing tin or indium.

Abstract translation: 半导体器件具有形成在半导体管芯上的第一导电层的半导体管芯。 第一绝缘层形成在半导体管芯上，第一绝缘层中的第一开口布置在第一导电层上。 在第一绝缘层上形成第二导电层，并在第一导电层上形成第一导电层。 互连结构形成在第二绝缘层的开口内的第一和第二导电层之上。 去除第二绝缘层。 互连结构可以是导电柱或导电垫。 凸起材料可以形成在导电柱上。 在导电柱或垫上方形成一层厚度小于1微米的保护涂层以减少氧化。 通过将导电柱或垫浸入含有锡或铟的浴中形成保护涂层。

公开(公告)号：US08380377B2

公开(公告)日：2013-02-19

申请号：US12730449

申请日：2010-03-24

Applicant: Jong Kyung Lim ,  Byeong Seob Song ,  Hong Seok Song ,  Ki Jong Lee ,  Shin Hye Chun ,  Won Kyoung Choi ,  Hyong Joon Park ,  Joon Hwan Kim

Inventor： Jong Kyung Lim ,  Byeong Seob Song ,  Hong Seok Song ,  Ki Jong Lee ,  Shin Hye Chun ,  Won Kyoung Choi ,  Hyong Joon Park ,  Joon Hwan Kim

IPC: B60K6/22 ,  H02M7/48

CPC classification number: B60L1/003 ,  B60K6/48 ,  B60K2001/003 ,  B60K2001/005 ,  B60L3/003 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2240/525 ,  Y02T10/6221 ,  Y02T10/7241 ,  Y02T90/16

Abstract: A method for controlling a cooling system for controlling a power converter of a hybrid electric vehicle includes: estimating the temperature of a power converter at the time of a CAN communication error as a current temperature of the power converter and controlling a cooling system at a cooling rate based on the estimated temperature; and controlling the cooling rate of the cooling system depending on whether an output of the power converter is greater than a reference value. According to the method, the cooling system can be more effectively controlled.

Abstract translation: 一种用于控制用于控制混合电动车辆的功率转换器的冷却系统的方法，包括：将CAN通信错误时的功率转换器的温度估计为功率转换器的当前温度并控制冷却系统的冷却 基于估计温度的速率; 以及根据所述功率转换器的输出是否大于参考值来控制所述冷却系统的冷却速率。 根据该方法，可以更有效地控制冷却系统。

公开(公告)号：US20070008601A1

公开(公告)日：2007-01-11

申请号：US11357220

申请日：2006-02-21

Applicant: Yong-kweun Mun ,  Won-kyoung Choi

Inventor： Yong-kweun Mun ,  Won-kyoung Choi

IPC: G02B26/08

CPC classification number: G02B27/0018 ,  G02B26/105

Abstract: The optical scanner package having: an optical scanner device scanning an incident beam and including a scanning mirror and a comb-electrode structure operating the scanning mirror; a package container containing the optical scanner device; and a package window that is formed on the package container to hermetically seal the package container, and includes a reflection mirror which reflects the scanned beam from the optical scanner device to a screen unit on one side, thus separating the path of the scanned beam from the path of a noise beam derived from the incident beam.

Abstract translation: 该光学扫描器封装具有：扫描入射光束并包括扫描反射镜的扫描器装置和操作该扫描反射镜的梳状电极结构; 包含光学扫描器装置的包装容器; 以及包装窗口，其形成在包装容器上以气密地密封包装容器，并且包括将扫描的光束从光学扫描器装置反射到一侧的屏幕单元的反射镜，从而将扫描的光束的路径从 从入射光束导出的噪声光束的路径。

公开(公告)号：US20060138652A1

公开(公告)日：2006-06-29

申请号：US11200120

申请日：2005-08-10

Applicant: Tae-hoon Jang ,  Won-kyoung Choi

Inventor： Tae-hoon Jang ,  Won-kyoung Choi

IPC: H01L23/34

CPC classification number: B23K35/0283 ,  B23K35/0222 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K2101/36 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/50 ,  B23K2103/52 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2924/0002 ,  H01S5/02272 ,  H01S5/02476 ,  H01L2924/00

Abstract: A solder for device packaging including a plurality of cores, and a coating solder mixed with the cores. The cores are formed of a material having a higher thermal conductivity than the coating solder.

Abstract translation: 一种用于器件封装的焊料，包括多个芯体，以及与芯体混合的涂层焊料。 芯由具有比涂层焊料更高的热导率的材料形成。

公开(公告)号：US09559004B2

公开(公告)日：2017-01-31

申请号：US13469754

申请日：2012-05-11

Applicant: Byung Joon Han ,  Il Kwon Shim ,  Won Kyoung Choi

Inventor： Byung Joon Han ,  Il Kwon Shim ,  Won Kyoung Choi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/78 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/481 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2223/5446 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81903 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/83851 ,  H01L2224/05552 ,  H01L2224/81805

Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

Abstract translation: 半导体器件包括载体，载体包括设置在载体上的粘合剂。 半导体器件还包括半导体晶片，其包括由非有源区分隔的多个半导体管芯。 在半导体管芯上形成多个凸点。 半导体晶片被安装到载体上，粘合剂设置在多个凸起周围。 照射能量被施加到非有源区域以在非活性区域内形成修饰区域。 半导体晶片沿着改质区域分割成半导体管芯。 通过向半导体晶片施加应力，沿着改质区域将半导体晶片分离。 在分离半导体晶片之后，从多个凸起周围除去粘合剂。 半导体晶片包括通过硅通孔的多个半导体管芯。 修改区域可选地包括多个垂直堆叠的改性区域。

公开(公告)号：US20130161824A1

公开(公告)日：2013-06-27

申请号：US13333395

申请日：2011-12-21

Applicant: Won Kyoung Choi ,  Chang Bum Yong ,  Jae Hun Ku

Inventor： Won Kyoung Choi ,  Chang Bum Yong ,  Jae Hun Ku

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/6836 ,  H01L21/768 ,  H01L21/76898 ,  H01L23/3178 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05578 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16146 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/01023 ,  H01L2224/05664 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01007 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A notch is formed in the semiconductor wafer around each of the conductive vias. The notch around the conductive vias can be formed by wet etching, dry etching, or LDA. A first insulating layer is formed over a surface of the semiconductor wafer and conductive vias and into the notch to provide stress relief between the conductive vias and semiconductor wafer. A portion of the first insulating layer is removed to expose the conductive vias. A first conductive layer and second insulating layer can be formed around the conductive vias. A second conductive layer can be formed over the conductive vias. The notch can extend into the second insulating layer.

Abstract translation: 半导体器件具有形成为半导体晶片的多个导电通孔。 去除半导体晶片的一部分，使得导电通孔延伸到半导体晶片的表面之上。 在每个导电通孔周围的半导体晶片中形成切口。 导电通孔周围的凹口可以通过湿蚀刻，干蚀刻或LDA形成。 第一绝缘层形成在半导体晶片和导电通孔的表面上并进入凹口中，以在导电通孔和半导体晶片之间提供应力消除。 去除第一绝缘层的一部分以露出导电通孔。 可以在导电通孔周围形成第一导电层和第二绝缘层。 可以在导电通孔上形成第二导电层。 凹口可以延伸到第二绝缘层中。

公开(公告)号：US20110183660A1

公开(公告)日：2011-07-28

申请号：US13011123

申请日：2011-01-21

Applicant: Won Kyoung CHOI

Inventor： Won Kyoung CHOI

IPC: H04W40/00 ,  H04W88/02

CPC classification number: H04W4/12 ,  H04L45/16 ,  H04L51/14 ,  H04L51/38 ,  H04W40/00

Abstract: A mobile terminal and a method for transmitting a message thereof are provided. The method for transmitting a message in a mobile terminal including at least two communication units capable of communicating with different communication networks, includes, identifying circuits connected through the at least two communication units when at least two identification information of other mobile terminals to which the message is to be transmitted is input, and simultaneously transmitting the message to the at least two other mobile terminals according to the identification information through the identified circuits. Through the method, a message can be simultaneously transmitted to a plurality of other mobile terminals using characteristics of a multi-standby mobile terminal. In addition, the message transmission method can reduce a time required to transmit a message.

Abstract translation: 提供了一种用于发送其消息的移动终端和方法。 用于在包括能够与不同通信网络进行通信的至少两个通信单元的移动终端中发送消息的方法包括：当至少两个通信单元的至少两个识别信息与其中的消息 要被发送，并且通过所识别的电路根据识别信息同时将消息发送到至少两个其他移动终端。 通过该方法，可以使用多待机移动终端的特性将消息同时发送到多个其他移动终端。 此外，消息发送方法可以减少发送消息所需的时间。