公开(公告)号：US20060273266A1

公开(公告)日：2006-12-07

申请号：US11437594

申请日：2006-05-19

申请人： Moshe Preil ,  Jun Ye ,  James Wiley ,  Shauh-Teh Juang ,  Michael Gassner

发明人： Moshe Preil ,  Jun Ye ,  James Wiley ,  Shauh-Teh Juang ,  Michael Gassner

IPC分类号： G01N21/86

CPC分类号： G03F7/7085 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/7065 ,  G03F7/70666

摘要： One embodiment of a method for detecting, sampling, analyzing, and correcting hot spots in an integrated circuit design allows the identification of the weakest patterns within each design layer, the accurate determination of the impact of process drifts upon the patterning performance of the real mask in a real scanner, and the optimum process correction, process monitoring, and RET improvements to optimize integrated circuit device performance and yield. The combination of high speed simulation coupled with massive data collection capability on actual aerial images and/or resist images at the specific patterns of interest provides a complete methodology for optimum RET implementation and process monitoring.

摘要翻译： 用于在集成电路设计中检测，采样，分析和校正热点的方法的一个实施例允许识别每个设计层内的最弱图案，精确确定工艺的影响漂移对真实掩模的图案化性能 在真正的扫描仪中，以及最佳的过程校正，过程监控和RET改进，以优化集成电路器件的性能和产量。 将高速仿真与实际航空图像上的海量数据收集能力和/或特定感兴趣图像的抗蚀图像相结合，为最佳的RET实施和过程监控提供了一个完整的方法。

公开(公告)号：US20070035712A1

公开(公告)日：2007-02-15

申请号：US11462022

申请日：2006-08-02

申请人： Michael Gassner ,  Stefan Hunsche ,  Yu Cao ,  Jun Ye ,  Moshe Preil

发明人： Michael Gassner ,  Stefan Hunsche ,  Yu Cao ,  Jun Ye ,  Moshe Preil

IPC分类号： G03B27/52

CPC分类号： G03F7/70666 ,  G03F7/70641

摘要： A method of using an in-situ aerial image sensor array is disclosed to separate and remove the focal plane variations caused by the image sensor array non-flatness and/or by the exposure tool by collecting sensor image data at various nominal focal planes and by determining best focus at each sampling location by analysis of the through-focus data. In various embodiments, the method provides accurate image data at best focus anywhere in the exposure field, image data covering an exposure-dose based process window area, and a map of effective focal plane distortions. The focus map can be separated into contributions from the exposure tool and contributions due to topography of the image sensor array by suitable calibration or self-calibration procedures. The basic method enables a wide range of applications, including for example qualification testing, process monitoring, and process control by deriving optimum process corrections from analysis of the image sensor data.

摘要翻译： 公开了一种使用原位空间图像传感器阵列的方法，以分离和去除由图像传感器阵列非平坦度引起的焦平面变化和/或通过曝光工具通过在各种标称焦平面处收集传感器图像数据，并且通过 通过分析焦点数据确定每个采样位置的最佳焦点。 在各种实施例中，该方法在曝光区域的任何地方提供最佳焦点上的精确图像数据，覆盖基于曝光剂量的过程窗口区域的图像数据和有效焦平面失真的映射。 焦点图可以通过适当的校准或自校准程序分为曝光工具的贡献和由于图像传感器阵列的形貌造成的贡献。 基本方法可以通过从图像传感器数据分析中得出最佳的过程校正，实现广泛的应用，包括例如鉴定测试，过程监控和过程控制。

公开(公告)号：US20050288893A1

公开(公告)日：2005-12-29

申请号：US10858330

申请日：2004-06-01

申请人： Michael Gassner

发明人： Michael Gassner

IPC分类号： G06F11/30 ,  G06F15/00 ,  G21C17/00

CPC分类号： H01L21/67253

摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for autonomously monitoring fabrication equipment, for example, integrated circuit fabrication equipment. In one embodiment of this aspect of the invention, the present invention is an autonomous monitoring device including one or more event sensors (for example, acceleration, motion, velocity and/or inertial sensing device(s)) to detect a predetermined event of or by the fabrication equipment (for example, an event that is indicative of the onset, commencement, initiation and/or launch of fabrication process or sub-processes of or by the fabrication equipment). In response thereto, one or more process parameter sensors sample, sense, detect, characterize, analyze and/or inspect one or more parameters of the process in real time (i.e., during the fabrication process).

摘要翻译： 这里描述和说明了许多发明。 一方面，本发明涉及用于自动监测制造设备的技术和系统，例如集成电路制造设备。 在本发明的该方面的一个实施例中，本发明是一种自主监测装置，其包括一个或多个事件传感器（例如，加速度，运动，速度和/或惯性感测装置），以检测预定事件或 通过制造设备（例如，指示制造设备的制造过程或子过程的开始，开始，启动和/或启动的事件）。 响应于此，一个或多个过程参数传感器实时采样，感测，检测，表征，分析和/或检查过程的一个或多个参数（即在制造过程中）。