Copper alloy and production of the same
    1.
    发明授权
    Copper alloy and production of the same 失效
    铜合金和生产相同

    公开(公告)号:US4656003A

    公开(公告)日:1987-04-07

    申请号:US786482

    申请日:1985-10-11

    IPC分类号: C22C9/06 C22F1/08

    CPC分类号: C22C9/06 C22F1/08

    摘要: There is provided a copper alloy which comprises 1.0 to 3.5 wt. % of Ni, 0.2 to 0.9 wt. % of Si, 0.02 to 1.0 wt. % of Mn, 0.1 to 5.0 wt. % of Zn, 0.1 to 2.0 wt. % of Sn, and 0.001 to 0.01 wt. % of Mg, and 0.001 to 0.01 wt. % of one or more members selected from Cr, Ti, and Zr, with the remainder being substantially Cu. The copper alloy is suitable for lead frames for semiconductors and is also suitable for terminals and connectors. The copper alloy is produced by a process which comprises starting cooling from a temperature above 600.degree. C. at a rate of 5.degree. C. per second or higher after hot rolling of an ingot of said copper alloy, performing annealing at a temperature of 400.degree. to 600.degree. C. for 5 minutes to 4 hours after cold working, performing refining finish rolling, and performing annealing at a temperature of 400.degree. to 600.degree. C. for a short time of 5 to 60 seconds.

    摘要翻译: 提供了一种铜合金,其包含1.0至3.5重量% %的Ni,0.2〜0.9重量% %的Si,0.02〜1.0wt。 Mn的%,0.1〜5.0重量% %的Zn,0.1〜2.0wt。 的Sn,0.001〜0.01重量% 的Mg,0.001〜0.01重量% %的选自Cr,Ti和Zr中的一种或多种,​​余量基本上为Cu。 铜合金适用于半导体的引线框架,也适用于端子和连接器。 铜合金通过以下方法制造,该方法包括:在所述铜合金的锭的热轧后以5℃/秒以上的速度从高于600℃的温度开始冷却,在400℃的温度下进行退火 在600℃〜600℃下冷却5分钟〜4小时,进行精炼精轧,在400〜600℃的温度下进行5〜60秒的短时间退火。