SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    2.
    发明申请
    SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 有权
    半导体集成电路设备

    公开(公告)号:US20090250680A1

    公开(公告)日:2009-10-08

    申请号:US12487492

    申请日:2009-06-18

    IPC分类号: H01L47/00

    摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.

    摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。

    Semiconductor integrated circuit device
    4.
    发明授权
    Semiconductor integrated circuit device 有权
    半导体集成电路器件

    公开(公告)号:US08129707B2

    公开(公告)日:2012-03-06

    申请号:US12487492

    申请日:2009-06-18

    IPC分类号: H01L47/00

    摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.

    摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。

    Semiconductor integrated circuit device
    7.
    发明申请
    Semiconductor integrated circuit device 审中-公开
    半导体集成电路器件

    公开(公告)号:US20080048166A1

    公开(公告)日:2008-02-28

    申请号:US11907989

    申请日:2007-10-19

    IPC分类号: H01L47/00

    摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.

    摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。

    Semiconductor integrated circuit device
    8.
    发明申请
    Semiconductor integrated circuit device 有权
    半导体集成电路器件

    公开(公告)号:US20060157680A1

    公开(公告)日:2006-07-20

    申请号:US11370945

    申请日:2006-03-09

    IPC分类号: H01L29/04

    摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.

    摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。