摘要:
An eddy current (EC) probe for inspecting a component is provided. The EC probe includes a tangential drive coil configured to generate a probing field for inducing eddy currents in the component, where a portion of the eddy currents are aligned parallel to an edge of the component. An axis of the tangential drive coil is aligned parallel to a surface of the component. The EC probe further includes a pair of sense coils, where an axis of the sense coils is aligned perpendicular to the surface of the component. The sense coils are configured to sense the portion of the eddy currents aligned parallel to the edge of the component.
摘要:
An omnidirectional eddy current (EC) probe includes at least one EC channel having a first and a second sense coil that are offset in a first (x) and a second (y) direction and overlap in at least one of the directions (x,y). At least one drive coil is configured to generate a probing field for the EC channel in a vicinity of the sense coils. An omnidirectional EC inspection system includes an omnidirectional EC array probe (ECAP) that includes a number of EC channels and drive coils. Each EC channel includes first and second sense coils with opposite polarities. The drive coils have alternating polarities. Electrical connections perform differential sensing for respective EC channels. Corrective drive coils are disposed at respective ends of the EC channels and generate probing fields. An eddy current instrument is connected to the omnidirectional ECAP and receives differential sensing signals from the EC channels.
摘要:
An inspection system for inspecting a part is provided. The inspection system includes a multi-dimensional array of eddy current sensors that conforms to a contour of a three dimensional shape of the part. The inspection system also includes a controller coupled to the multi-dimensional array, wherein the controller is configured to electronically scan the part via an electrical connection of the eddy current sensors to an eddy current instrument. The inspection system further includes a processor coupled to the eddy current instrument, wherein the processor is configured to analyze output from the eddy current instrument and the controller to accomplish inspection of the part.
摘要:
An inspection system for inspecting a part is provided. The inspection system includes a multi-dimensional array of eddy current sensors that conforms to a contour of a three dimensional shape of the part. The inspection system also includes a controller coupled to the multi-dimensional array, wherein the controller is configured to electronically scan the part via an electrical connection of the eddy current sensors to an eddy current instrument. The inspection system further includes a processor coupled to the eddy current instrument, wherein the processor is configured to analyze output from the eddy current instrument and the controller to accomplish inspection of the part.
摘要:
A method for detecting small cracks and other anomalies on parts having complex geometries is disclosed. The method includes eddy current inspection incorporating collection of data from multi-frequency eddy current signals. Phase analysis is used to combine the multi-frequency data to enhance the signal to noise ratio of the raw inspection image. The image is then reprocessed using a spatiotemporal filter to correlate with the frequency components of the eddy current flaw signal to separate signals associated with cracks and other flaws at edges that would ordinarily be hidden by edge effect signals.
摘要:
A method for inspecting a component. The method includes generating a scan plan of a component to be inspected, coupling a side-mount probe to an eddy current inspection system, inducing an eddy current into the component, measuring the eddy current in the component to generate a plurality of scan data, and analyzing the scan data to generate at least one image of the component being inspected.
摘要:
A method for generating a scanplan for inspection of a component is provided. The method includes loading a geometric model of the component and generating the scanplan of the component based on the geometric model and at least one scanning parameter. A method of inspecting a component is also provided and includes loading a geometric model of the component, generating a scanplan of the component based on the geometric model and at least one scanning parameter, mounting the component on an inspection system manipulator and inspecting the component including moving an inspection probe relative to the component using the scanplan.
摘要:
A method for inspecting a component having a surface profile that includes a local minima and a local maxima. The method includes positioning an eddy current probe proximate to a surface of the component to generate a first position indication, positioning the eddy current probe proximate to the surface of the component to generate a second position indication that is different than the first position indication, and interpolating between the first and second position indications to determine a profile of a portion of the surface of the component.
摘要:
A method for inspecting a part is provided. The method includes applying a number of multifrequency excitation signals to a probe to generate a number of multifrequency response signals for the part being inspected. The method further includes performing a multifrequency phase analysis on the multifrequency response signals to inspect a subsurface of the part. An inspection system is provided and includes an eddy current (EC) probe configured to induce eddy currents in a part. The system further includes an eddy current instrument coupled to the EC probe and configured to apply multifrequency excitation signals to the EC probe to generate multifrequency response signals. The system further includes a processor configured to analyze the multifrequency response signals from the EC instrument by performing a multifrequency phase analysis, to inspect a subsurface of the part.
摘要:
A method for testing a component using an eddy current array probe is provided. The method includes calibrating the eddy current array probe, collecting data from the eddy current array probe for analysis, and processing the collected data to at least one of compensate for response variations due to a detected orientation of a detected imperfection and to facilitate minimizing noise.