公开(公告)号：US20180069168A1

公开(公告)日：2018-03-08

申请号：US15795579

申请日：2017-10-27

Applicant: Murata Manufacturing Co, Ltd.

Inventor： SHINSUKE IKEUCHI ,  KANSHO YAMAMOTO ,  TAKUO HADA ,  YOICHI MOCHIDA ,  HIDEYA HORIUCHI

IPC: H01L41/09 ,  H01L41/107 ,  H01L41/314 ,  H01L41/187

CPC classification number: H01L41/09 ,  H01L41/044 ,  H01L41/0471 ,  H01L41/083 ,  H01L41/107 ,  H01L41/187 ,  H01L41/31 ,  H01L41/314 ,  H04R17/00 ,  H04R2201/003

Abstract: A piezoelectric device that includes a base member having an opening therein and an upper layer supported by the base member. The upper layer includes a vibration portion at a location corresponding to the opening in the base member. The vibration portion includes a lower electrode, an intermediate electrode and an upper electrode that are spaced apart from one another in a thickness direction of the piezoelectric device. The upper layer includes a first piezoelectric layer disposed so as to be at least partially sandwiched between the lower electrode and the intermediate electrode, and a second piezoelectric layer disposed so as to overlap with the first piezoelectric layer and so as to be at least partially sandwiched between the intermediate electrode and the upper electrode. The first piezoelectric layer and the second piezoelectric layer are different in relative permittivity in the thickness direction of the piezoelectric device.

公开(公告)号：US20170309811A1

公开(公告)日：2017-10-26

申请号：US15641470

申请日：2017-07-05

Applicant: Murata Manufacturing CO., Ltd.

Inventor： KANSHO YAMAMOTO ,  Takuo Hada

IPC: H01L41/29 ,  H01L41/338 ,  H01L41/332 ,  H05B3/03 ,  H01L41/08

CPC classification number: H01L41/29 ,  H01L41/0805 ,  H01L41/09 ,  H01L41/113 ,  H01L41/23 ,  H01L41/253 ,  H01L41/314 ,  H01L41/332 ,  H01L41/338 ,  H01L41/39 ,  H03H3/02 ,  H03H9/174 ,  H03H9/583 ,  H03H2003/0414 ,  H03H2009/02181 ,  H05B3/03 ,  H05B3/26

Abstract: A method for manufacturing a piezoelectric device that includes a substrate, a piezoelectric layer directly or indirectly supported by the substrate and arranged above the substrate, a heater, and a heater electrode for driving the heater. Moreover, the method includes forming the piezoelectric layer, the heater, and the heater electrode and subjecting the piezoelectric device to heat treatment with heat generated from the heater by driving the heater by feeding electric power to the heater electrode.