公开(公告)号：US11552020B2

公开(公告)日：2023-01-10

申请号：US17398574

申请日：2021-08-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC: H05K1/02 ,  H01L23/538 ,  H01L21/48 ,  H01L23/498 ,  H01L25/16 ,  H02M3/00

Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US11121123B2

公开(公告)日：2021-09-14

申请号：US16907557

申请日：2020-06-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC: H05K3/46 ,  H01L25/16 ,  H01L21/48 ,  H01L23/498 ,  H02M3/00

Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US20200321323A1

公开(公告)日：2020-10-08

申请号：US16907557

申请日：2020-06-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC: H01L25/16 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US20210375841A1

公开(公告)日：2021-12-02

申请号：US17398574

申请日：2021-08-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/498

Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.