摘要:
A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
摘要:
This disclosure provides a ferrite ceramic composition, a ceramic electronic component including the ceramic composition, and a process of producing a ceramic electronic component including the ferrite ceramic composition, of which the insulation performance can be secured even when fired simultaneously with a metal wire material containing Cu as the main component, and which can have good electric properties. The ferrite ceramic composition includes an Ni—Mn—Zn-based ferrite having a molar content of CuO of 5 mol % or less and in which, when the molar content (x) of Fe2O3 and the molar content (y) of Mn2O3 are expressed by a coordinate point (x,y), the coordinate point (x,y) is located in an area bounded by coordinate points A (25,1), B (47,1), C (47,7.5), D (45,7.5), E (45,10), F (35,10), G (35,7.5) and H (25,7.5).
摘要翻译:本公开内容提供了一种铁氧体陶瓷组合物,包括陶瓷组合物的陶瓷电子部件以及包括铁氧体陶瓷组合物的陶瓷电子部件的制造方法,其中即使在与含有 Cu作为主要成分,具有良好的电性能。 铁氧体陶瓷组合物包括摩尔含量为5摩尔%以下的Ni-Mn-Zn系铁氧体,其中,当Fe 2 O 3的摩尔含量(x)和Mn 2 O 3的摩尔含量(y)表示时 坐标点(x,y),坐标点(x,y)位于坐标点A(25,1),B(47,1),C(47,7.5),D( 45,7.5),E(45,10),F(35,10),G(35,7.5)和H(25,7.5)。
摘要:
A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
摘要:
A ceramic electronic component includes a ferrite material magnetic body part and a Cu conductive part, the ferrite containing 20 to 48% trivalent Fe in terms of Fe2O3 and divalent Ni. The ferrite can contain Mn so that it is less than 50% of the total of Fe and Mn in terms of Mn2O3 and Fe2O3. The magnetic and conductive parts are co-fired at a pressure not exceeding the equilibrium oxygen partial pressure of Cu—Cu2O thereby ensuring insulating performance and favorable electrical characteristics.
摘要:
A laminated coil component includes a magnetic body part made of a ferrite material and a coil conductor wound into a coil shape and embedded in the magnetic body part to form a component base. The component base is divided into a first region near the coil conductor and a second region other than the first region. The grain size ratio of the average crystal grain size of the magnetic body part in the first region to the average crystal grain size of the magnetic body part in the second region is 0.9 or less. The molar content of CuO in the ferrite raw material is set to 0.2 to 4 mol %. In a method laminated coil component, the coil is formed from a conductive paste including Ag, and firing the laminated body is performed by setting the oxygen concentration is 0.1 volume % or less as a firing atmosphere.
摘要:
A ceramic electronic component which can achieve favorable electrical properties in such a way that the insulation property of a magnetic section can be ensured, and that the oxidation of Cu as an internal conductor is suppressed. A method for manufacturing ceramic electronic component has a feature that includes a firing step of firing at a predetermined temperature rising rate X (° C./min) and oxygen partial pressure Y (Pa), and when the temperature rising rate and the oxygen partial pressure are respectively indicated on an x axis and a Y axis, the firing is carried out under the condition indicated by the region surrounded by (X, Y)=A (50, 0.05), B (1000, 0.05), C (1000, 0.01), D (1500, 0.01), E (1500, 0.001), F (2000, 0.001), G (2000, 100), H (1500, 100), I (1500, 50), J (1000, 50), K (1000, 10), and L (50, 10).
摘要:
A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.
摘要:
A ceramic electronic component includes a ferrite material magnetic body part and a Cu conductive part, the ferrite containing 20 to 48% trivalent Fe in terms of Fe2O3 and divalent Ni. The ferrite can contain Mn so that it is less than 50% of the total of Fe and Mn in terms of Mn2O3 and Fe2O3. The magnetic and conductive parts are co-fired at a pressure not exceeding the equilibrium oxygen partial pressure of Cu—Cu2O thereby ensuring insulating performance and favorable electrical characteristics.
摘要:
A ceramic electronic component which can achieve favorable electrical properties in such a way that the insulation property of a magnetic section can be ensured, and that the oxidation of Cu as an internal conductor is suppressed. A method for manufacturing ceramic electronic component has a feature that includes a firing step of firing at a predetermined temperature rising rate X (° C./min) and oxygen partial pressure Y (Pa), and when the temperature rising rate and the oxygen partial pressure are respectively indicated on an x axis and a Y axis, the firing is carried out under the condition indicated by the region surrounded by (X, Y)=A (50, 0.05), B (1000, 0.05), C (1000, 0.01), D (1500, 0.01), E (1500, 0.001), F (2000, 0.001), G (2000, 100), H (1500, 100), I (1500, 50), J (1000, 50), K (1000, 10), and L (50, 10).
摘要:
A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.