公开(公告)号：US20200321323A1

公开(公告)日：2020-10-08

申请号：US16907557

申请日：2020-06-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L21/48

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US11121123B2

公开(公告)日：2021-09-14

申请号：US16907557

申请日：2020-06-22

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H05K3/46 ,  H01L25/16 ,  H01L21/48 ,  H01L23/498 ,  H02M3/00

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US20210375841A1

公开(公告)日：2021-12-02

申请号：US17398574

申请日：2021-08-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H01L25/16 ,  H01L21/48 ,  H01L23/498

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

公开(公告)号：US10794695B2

公开(公告)日：2020-10-06

申请号：US15784277

申请日：2017-10-16

申请人： Murata Manufacturing Co., Ltd.

发明人： Tatsuya Kitamura ,  Hironari Yamamoto

IPC分类号： G01C3/06 ,  G01S17/10 ,  G01S17/89 ,  G01S7/4865 ,  H04N5/353

摘要： A range sensor includes a light source, a light receiver, a controller, and a range information generator. The light source repeatedly emits illumination light onto a target. The light receiver receives light from the start of a time period during which the illumination light is emitted. The controller controls the light source and the light receiver so that each of the amounts of light received by the light receiver is cumulated in synchronization with emission of the illumination light. The range information generator generates range information indicating the range to the target based on the cumulative amounts of received light. The controller changes the cumulative number that is the number of cumulating operations in which the light receiver cumulates each of the amounts of received light, in accordance with the magnitudes of the cumulative amounts of received light.

公开(公告)号：US11552020B2

公开(公告)日：2023-01-10

申请号：US17398574

申请日：2021-08-10

申请人： Murata Manufacturing Co., Ltd.

发明人： Koshi Himeda ,  Tatsuya Kitamura ,  Chiharu Sakaki ,  Shinya Kiyono ,  Sho Fujita ,  Atsushi Yamamoto ,  Takeshi Furukawa ,  Kenji Nishiyama ,  Tatsuya Funaki ,  Kinya Aoki

IPC分类号： H05K1/02 ,  H01L23/538 ,  H01L21/48 ,  H01L23/498 ,  H01L25/16 ,  H02M3/00

摘要： A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.