公开(公告)号：US12046838B2

公开(公告)日：2024-07-23

申请号：US17901018

申请日：2022-09-01

申请人： Murata Manufacturing Co., Ltd.

发明人： Koji Kamada ,  Kunihiro Komaki ,  Masahiro Izawa ,  Ryo Komura

IPC分类号： H01Q9/04 ,  H01Q1/48 ,  H05K1/16

CPC分类号： H01Q9/0407 ,  H01Q1/48 ,  H05K1/162 ,  H05K2201/09672 ,  H05K2201/10098

摘要： An element assembly has a structure in which insulator layers including first and second insulator layers are laminated in an up-down direction. The first insulator layer is above the second insulator layer. A radiant conductor layer is on an upper surface of the first insulator layer. A first capacitance defining portion includes a first interlayer connection conductor passing through one or more of the insulator layers in the up-down direction. The first interlayer connection conductor is electrically connected to the radiant conductor layer. The radiant conductor layer, a ground conductor, and the first capacitance defining portion define and function as a patch antenna. When the first interlayer connection conductor is electrically connected to the radiant conductor layer, a distance from a lower end of the first interlayer connection conductor to the ground conductor in the up-down direction is shorter than a distance from the radiant conductor layer to the ground conductor in the up-down direction.

公开(公告)号：US11166386B2

公开(公告)日：2021-11-02

申请号：US16522704

申请日：2019-07-26

申请人： Murata Manufacturing Co., Ltd.

发明人： Keito Yonemori ,  Hirokazu Yazaki ,  Takanori Tsuchiya ,  Koji Kamada

IPC分类号： H05K1/18 ,  H05K3/46 ,  H05K1/14 ,  H01B7/08 ,  H01F17/00 ,  H01F27/06 ,  H01R43/02

摘要： An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.

公开(公告)号：US11032904B2

公开(公告)日：2021-06-08

申请号：US16438519

申请日：2019-06-12

申请人： Murata Manufacturing Co., Ltd.

发明人： Hirokazu Yazaki ,  Keito Yonemori ,  Takanori Tsuchiya ,  Koji Kamada ,  Takashi Noma

IPC分类号： H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K1/11 ,  H01R12/62 ,  H05K1/02 ,  H05K1/14 ,  H05K3/46 ,  H05K3/36

摘要： An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.