公开(公告)号：US20180205155A1

公开(公告)日：2018-07-19

申请号：US15923142

申请日：2018-03-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryuken MIZUNUMA ,  Shinichiro BANBA ,  Michiharu YOKOYAMA ,  Hideki UEDA ,  Hideaki YAMADA ,  Noboru MORIOKA

IPC: H01Q21/00 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q1/22 ,  H01Q21/06 ,  H01L23/66

CPC classification number: H01Q21/0025 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q3/2605 ,  H01Q21/0087 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/067 ,  H01Q23/00 ,  H01Q25/00 ,  H04B7/00 ,  H05K1/0243

Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.

公开(公告)号：US20190215993A1

公开(公告)日：2019-07-11

申请号：US16299328

申请日：2019-03-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshikazu YAGI ,  Kazushige SATO ,  Akihiro HARA ,  Noboru MORIOKA ,  Nobumitsu AMACHI

IPC: H05K9/00 ,  H01L23/02 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K3/32

Abstract: A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.