COIL COMPONENT, COIL MODULE, AND METHOD FOR MANUFACTURING COIL COMPONENT
    2.
    发明申请
    COIL COMPONENT, COIL MODULE, AND METHOD FOR MANUFACTURING COIL COMPONENT 审中-公开
    线圈组件,线圈模块和制造线圈组件的方法

    公开(公告)号:US20160372259A1

    公开(公告)日:2016-12-22

    申请号:US15255965

    申请日:2016-09-02

    Abstract: A coil component that includes a coil having a thick coil core and good inductance characteristics and is able to narrow the pitch of a coil electrode is provided. The wiring of a coil electrode in a direction across the direction of a winding axis of the coil electrode includes a plurality of first metal pins and a plurality of second metal pins. By elongating each metal pin, the wiring of the coil electrode is easily elongated in a metal pin direction. Thus, a coil core is easily thickened in the metal pin direction. The wiring of the coil electrode can be formed in the metal pin direction only by arranging the metal pins. Thus, it is possible to provide a coil component that includes a coil having the thick coil core and good inductance characteristics and is able to narrow the pitch of the coil electrode.

    Abstract translation: 提供一种线圈部件,其包括具有厚的线圈芯线和良好的电感特性并且能够使线圈电极的间距变窄的线圈。 线圈电极沿着线圈电极的卷绕轴线方向的布线包括多个第一金属销和多个第二金属销。 通过延长每个金属销,线圈电极的布线容易在金属销方向上伸长。 因此,线圈芯在金属销方向上容易增厚。 线圈电极的布线只能通过布置金属销而形成在金属销方向上。 因此,可以提供包括具有厚线圈芯线圈和良好的电感特性的线圈的线圈部件,并且能够使线圈电极的间距变窄。

    FUSE
    3.
    发明申请
    FUSE 审中-公开
    保险丝

    公开(公告)号:US20150303018A1

    公开(公告)日:2015-10-22

    申请号:US14753124

    申请日:2015-06-29

    Inventor: Shinichiro BANBA

    Abstract: A fuse includes an insulating substrate, a wiring, low-melting-point metal portions insulating layers and metal films. The wiring is located on one principal surface of the insulating substrate. The low-melting-point metal portions are provided over the wiring. The low-melting-point metal portions have a lower melting point than the wiring, and dissolves the wiring when the portions turn into a melt. The insulating layers are located between the wiring and the low-melting-point metal portions. The metal films are located outside the insulating layers on the insulating substrate.

    Abstract translation: 保险丝包括绝缘基板,布线,低熔点金属部分绝缘层和金属膜。 布线位于绝缘基板的一个主表面上。 低熔点金属部分设置在布线上。 低熔点金属部分具有比布线低的熔点,并且当部分变成熔体时溶解布线。 绝缘层位于布线和低熔点金属部分之间。 金属膜位于绝缘基板上的绝缘层的外侧。

    ELECTRONIC COMPONENT MODULE
    4.
    发明申请

    公开(公告)号:US20220028750A1

    公开(公告)日:2022-01-27

    申请号:US17498389

    申请日:2021-10-11

    Abstract: An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.

    INDUCTOR COMPONENT MANUFACTURING METHOD AND INDUCTOR COMPONENT

    公开(公告)号:US20170178796A1

    公开(公告)日:2017-06-22

    申请号:US15451465

    申请日:2017-03-07

    CPC classification number: H01F27/29 H01F17/0013 H01F41/04 H01F41/041

    Abstract: An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

    COIL MODULE
    6.
    发明申请
    COIL MODULE 审中-公开
    线圈模块

    公开(公告)号:US20170018349A1

    公开(公告)日:2017-01-19

    申请号:US15276888

    申请日:2016-09-27

    Abstract: A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.

    Abstract translation: 线圈部件仅具有作为线圈电极的一部分的第一和第二柱状导体。 这可以简化制造过程并降低线圈部件的成本。 布线基板设置有形成线圈电极的剩余部分的基板侧布线电极迹线。 在使用常用的基板形成技术形成布线基板的过程中,可以容易地与其它布线电极一起形成基板侧布线电极迹线。 因此,通过将线圈部件配置在配线基板上而构成线圈电极,能够廉价地制造包括线圈部件的线圈模块。

    COIL COMPONENT
    7.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20170316858A1

    公开(公告)日:2017-11-02

    申请号:US15653917

    申请日:2017-07-19

    Abstract: A coil component includes an insulating layer; an annular ring-shaped coil core embedded in the insulating layer; a coil electrode wound around the coil core; an input electrode designed for external connection, disposed on a lower surface of the insulating layer, and connected to a first end of the coil electrode; and an output electrode designed for external connection, disposed on the lower surface of the insulating layer, and connected to a second end of the coil electrode. One of the input electrode and the output electrode is disposed inside the coil core in a plan view. With this configuration, unlike a conventional coil component in which both input and output electrodes are disposed outside a coil core, it is possible not only to easily reduce the area of the coil component in a plan view, but also to improve heat dissipation characteristics of the coil component.

    MODULE
    8.
    发明申请
    MODULE 审中-公开
    模块

    公开(公告)号:US20160358707A1

    公开(公告)日:2016-12-08

    申请号:US15244356

    申请日:2016-08-23

    Abstract: A module includes: an insulating layer; an annular coil core in the insulating layer; a coil electrode having outer metal pins arranged along an outer circumferential surface of the coil core, inner metal pins arranged along an inner circumferential surface of the coil core to form pairs with corresponding outer metal pins 7, bonding wires, each connecting one end surface of each outer metal pin and inner metal pin that form a pair, and wiring electrode patterns, each connecting another end surface of each outer metal pin to another end surface of an inner metal pin adjacent in a predetermined direction to the inner metal pin that forms a pair with the outer metal pin; and a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that covers the surface of the coil core.

    Abstract translation: 模块包括:绝缘层; 绝缘层中的环形线圈芯; 具有沿着线圈芯的外周面布置的外金属销的线圈电极,沿着线圈芯的内圆周表面布置的内金属销,以与相应的外金属销7形成对,每个连接线连接一个端面 每个外金属销和内金属销形成一对,以及布线电极图案,每个连接电极图案将每个外金属销的另一个端面连接到内金属销的另一个端面,该内金属销与预定方向相邻,形成内金属销 与外金属针对; 以及覆盖线圈芯的表面的由绝缘层的弹性模量低的非导电材料形成的缓冲层。

    ELECTRONIC DEVICE
    9.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号:US20160351322A1

    公开(公告)日:2016-12-01

    申请号:US15232978

    申请日:2016-08-10

    Abstract: An electronic device includes an insulating layer, a plurality of upper wiring electrode patterns formed on an upper surface of the insulating layer, and a plurality of lower wiring electrode patterns formed on a lower surface of the insulating layer. The upper wiring electrode patterns and the lower wiring electrode patterns each include an underlying electrode layer formed of a conductive paste and a plating electrode layer formed on the underlying electrode layer. With this configuration, the resistivity of the upper and lower wiring electrode patterns and can be made lower than that of the upper and lower wiring electrode patterns and each including only the underlying electrode layer formed of a conductive paste.

    Abstract translation: 电子器件包括绝缘层,形成在绝缘层的上表面上的多个上部布线电极图案和形成在绝缘层的下表面上的多个下部布线电极图案。 上布线电极图案和下布线电极图案各自包括由导电浆料形成的下电极层和形成在下电极层上的电镀电极层。 利用这种结构,可以使上下布线电极图案的电阻率低于上下布线电极图案的电阻率,并且每个仅包括由导电浆料形成的底部电极层。

    MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR
    10.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR 有权
    多层陶瓷基板及其制造方法

    公开(公告)号:US20140110160A1

    公开(公告)日:2014-04-24

    申请号:US14136004

    申请日:2013-12-20

    Abstract: A multilayer ceramic substrate includes a ceramic element body including a plurality of stacked ceramic layers, a resistor including a resistance film disposed between the ceramic layers, and a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance film. The resistance film and the lead via conductor both contain, for example, Ni and Cu that constitute an alloy resistive material. A concentration of the Ni component in the lead via conductor has a gradient structure that is comparatively high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a second end portion opposite therefrom.

    Abstract translation: 多层陶瓷基板包括陶瓷元件体,该陶瓷元件体包括多个堆叠的陶瓷层,包括设置在陶瓷层之间的电阻膜的电阻器和在厚度方向上贯穿陶瓷层的引线通孔导体,并在第一端部连接到 电阻膜。 电阻膜和引线通孔导体都包含例如构成合金电阻材料的Ni和Cu。 导线通孔导体中的Ni成分的浓度在与电阻膜连接的第一端部具有比较高的梯度结构,并且从第一端部向与其相反的第二端部逐渐减小。

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