公开(公告)号：US20160128199A1

公开(公告)日：2016-05-05

申请号：US14928136

申请日：2015-10-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaru TAKAHASHI ,  Choichiro FUJII

IPC: H05K1/18 ,  H01G4/30 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01G2/106 ,  H01G4/224 ,  H01G4/30 ,  H01G4/33 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/122 ,  Y02P70/611

Abstract: A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.

Abstract translation: 内置电子部件基板包括芯基板，通过接合部件安装在芯基板的一个主表面上的电子部件和包含嵌入其中的电子部件的树脂层。 电子部件是包括陶瓷多层体的多层陶瓷电容器和包括端面部的第一外部电极和包括设置在陶瓷多层体的端面上的端面部的第二外部电极。 树脂层与第一外部电极和接合部件的端面部之间设置有第一间隙，在第二外部电极和接合部件的树脂层与端面部之间设置第二间隙。

公开(公告)号：US20150364261A1

公开(公告)日：2015-12-17

申请号：US14734056

申请日：2015-06-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaru TAKAHASHI

IPC: H01G4/30 ,  H01G4/06

CPC classification number: H01G4/06 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  Y02P70/613

Abstract: A mounted structure includes a laminated capacitor, a wiring substrate, and a joint material. The laminated capacitor includes a body with dielectric layers and internal electrode layers alternately stacked, and an external electrode connected to the internal electrode layers. The body includes a side surface coated with a side surface coating portion of the external electrode. The joint material is joined to the side surface coating portion and a land provided on the wiring substrate so as to cover the outer surfaces thereof. The outer end portion of the thickest portion of the joint material covering the side surface coating portion is located farther outside an outer end of the land in a direction perpendicular or substantially perpendicular to a side surface of the body.

Abstract translation: 安装结构包括层压电容器，布线基板和接合材料。 叠层电容器包括具有交替堆叠的电介质层和内部电极层的主体和连接到内部电极层的外部电极。 主体包括涂覆有外部电极的侧表面涂覆部分的侧表面。 接合材料接合到侧表面涂覆部分和设置在布线基板上以覆盖其外表面的平台。 覆盖侧面涂覆部分的接合材料最厚部分的外端部分位于与主体侧表面垂直或基本垂直的方向上更远离焊盘外端。

公开(公告)号：US20240404756A1

公开(公告)日：2024-12-05

申请号：US18800367

申请日：2024-08-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaru TAKAHASHI

IPC: H01G4/232 ,  H01G4/005 ,  H01G4/12 ,  H01G4/224 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes a multilayer body, and external electrodes respectively provided on the two end surfaces of the multilayer body. The external electrodes each include a base electrode layer, a first plated layer on top of the base electrode layer, a second plated layer on top of the first plated layer, and an adhesive force mitigation layer located between the first plated layer and the second plated layer while allowing the second plated layer to be in contact with the first plated layer.

公开(公告)号：US20170171980A1

公开(公告)日：2017-06-15

申请号：US15444425

申请日：2017-02-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Masaru TAKAHASHI ,  Choichiro FUJII ,  Hirobumi ADACHI

IPC: H05K1/18 ,  H01G4/12 ,  H01G4/005 ,  H01G4/30 ,  H01G4/228

CPC classification number: H05K1/185 ,  H01G4/005 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0271 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10378

Abstract: An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.

公开(公告)号：US20230317375A1

公开(公告)日：2023-10-05

申请号：US18124606

申请日：2023-03-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichiro MORIMOTO ,  Toshiyuki NAKAMURA ,  Noriyuki OOKAWA ,  Daisho TSUBOKAWA ,  Masaru TAKAHASHI ,  Nobuyasu HAMAMORI

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/06

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/065

Abstract: In a three-terminal multilayer ceramic capacitor, each of first through fourth external electrodes includes a base electrode layer including a conductive metal and a glass component, an organic layer including an organosilicon compound covering the base electrode layer, and a plating layer on the organic layer. On a surface of the organic layer in a portion facing the plating layer, an atomic concentration ratio of Si to Cu is greater than or equal to about 1.5% and less than or equal to about 5.5%, or greater than or equal to about 0.8% and less than or equal to about 2.8%, and a surface roughness is greater than or equal to about 0.334 and less than or equal to about 0.371, or greater than or equal to about 0.352 and less than or equal to about 0.395.

公开(公告)号：US20190037696A1

公开(公告)日：2019-01-31

申请号：US16134061

申请日：2018-09-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadateru YAMADA ,  Masaru TAKAHASHI ,  Isamu FUJIMOTO ,  Kazuo HATTORI

IPC: H05K1/16 ,  H01G4/30 ,  H01G4/12

Abstract: A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor mounted on one principal surface of the circuit board, a first resin layer provided on the one principal surface of the circuit board, and a second resin layer provided on the first resin layer and embedding the multilayer capacitor. The Young's modulus of the first resin layer is smaller than that of the second resin layer.

公开(公告)号：US20190035557A1

公开(公告)日：2019-01-31

申请号：US16134053

申请日：2018-09-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadateru YAMADA ,  Isamu FUJIMOTO ,  Kazuo HATTORI ,  Masaru TAKAHASHI

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H05K1/03 ,  H05K1/181 ,  H05K2201/10015

Abstract: A mounting structure includes a circuit board including one principal surface on which a multilayer capacitor is mounted. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor on one principal surface of the circuit board, and a resin layer on the one principal surface of the circuit board and embedding the multilayer capacitor. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer.