ELECTRONIC COMPONENT
    2.
    发明公开

    公开(公告)号:US20240071672A1

    公开(公告)日:2024-02-29

    申请号:US18503717

    申请日:2023-11-07

    CPC classification number: H01F27/022 H01F27/255 H01F37/00

    Abstract: An electronic component that includes a base body and insulating film covering an outer surface of the base body. The outer surface has a first boundary surface including a curved surface that is present at a boundary between a first surface and a second surface of the outer surface. An inner angle of the base body among angles formed by the first surface and the second surface is less than 180 degrees. The average value of a thickness dimension from the first boundary surface to the surface of an insulating film portion covering the first boundary surface is greater than the average value from the first surface to the surface of an insulating film portion covering the first surface in the thickness direction.

    MULTILAYER CERAMIC CAPACITOR
    4.
    发明申请

    公开(公告)号:US20220102079A1

    公开(公告)日:2022-03-31

    申请号:US17487385

    申请日:2021-09-28

    Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers, the external electrode layers each further including a base electrode layer including a first region, a second region, and a third region divided therein, in order from the multilayer body. The first region includes a metal included in the internal electrode layers in a higher amount than the second region and the third region, the second region includes glass in a higher amount than the first region and the third region, and the third region includes copper in a higher amount than the first region and the second region.

    ELECTRONIC COMPONENT THAT SUPPRESSES MIGRATION IN EXTERNAL ELECTODES

    公开(公告)号:US20250149248A1

    公开(公告)日:2025-05-08

    申请号:US19017840

    申请日:2025-01-13

    Abstract: An electronic component includes a base body, and a first internal electrode and a second internal electrode located inside the base body. In addition, the electronic component includes a first external electrode and a second external electrode that cover a part of the outer surface of the base body and do not contain a silver component. The first external electrode includes a first electrode covering a part of the outer surface of the base body and connected to the first internal electrode, and a second electrode covering the outer surface of the first electrode. The second electrode contains copper particles and a silicone resin as a synthetic resin. When viewed in a specific section including the first electrode and the second electrode, the copper particles of the second electrode are in line contact with the outer surface of the first electrode.

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20240234036A1

    公开(公告)日:2024-07-11

    申请号:US18612190

    申请日:2024-03-21

    Inventor: Noriyuki OOKAWA

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

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