ELECTRONIC COMPONENT MODULE
    1.
    发明申请

    公开(公告)号:US20220028750A1

    公开(公告)日:2022-01-27

    申请号:US17498389

    申请日:2021-10-11

    Abstract: An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.

    TERMINAL STRUCTURE AND ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20240096772A1

    公开(公告)日:2024-03-21

    申请号:US18523058

    申请日:2023-11-29

    CPC classification number: H01L23/49811 H05K1/0237 H01L23/3121

    Abstract: A plurality of first terminal pins are placed side by side in a first direction. A plurality of second terminal pins are placed to extend in parallel with the plurality of first terminal pins. The plurality of first terminal pins and the plurality of second terminal pins include an inside face facing each other, an outside face opposite to the inside face, and side faces connecting the inside face and the outside face. At least one of the side faces includes a first portion having a relatively rough surface, and a second portion having a relatively fine surface and having approximately the same roughness as the inside face and the outside face.

    RADIO COMMUNICATION MODULE
    4.
    发明申请

    公开(公告)号:US20220302594A1

    公开(公告)日:2022-09-22

    申请号:US17836190

    申请日:2022-06-09

    Abstract: A radio communication module is provided that includes a circuit board, a first radiation conductor, and an insulating resin. In the circuit board, a first main surface and a second main surface are included, and a second radiation conductor is provided on the second main surface of the circuit board. The first radiation conductor is flat and is provided near the first main surface. The insulating resin is provided near the first main surface side. The thickness of the first radiation conductor is larger than the thickness of the second radiation conductor.

Patent Agency Ranking