公开(公告)号：US20220238455A1

公开(公告)日：2022-07-28

申请号：US17659389

申请日：2022-04-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuo ISHIDO ,  Motohiko KUSUNOKI ,  Minoru KOMIYAMA

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/498

Abstract: A module includes a substrate having a first surface, a first component and a second component that are mounted on the first surface, a first conductive material mounted between the first component and the second component, a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material, and a first shield film that covers the first sealing resin, in which the first sealing resin has a recess to expose at least a part of the first conductive material, the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material, the first shield film is provided with an opening in the recess, a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening.

公开(公告)号：US20210210438A1

公开(公告)日：2021-07-08

申请号：US17210630

申请日：2021-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Shin FURUYA ,  Toru KOIDESAWA ,  Motohiko KUSUNOKI ,  Tetsuya ODA

IPC: H01L23/552 ,  H01L23/29 ,  H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H01L21/56

Abstract: A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

公开(公告)号：US20230225092A1

公开(公告)日：2023-07-13

申请号：US18185621

申请日：2023-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toru KOMATSU ,  Motohiko KUSUNOKI ,  Tadashi NOMURA

IPC: H05K9/00 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K9/003 ,  H05K1/186 ,  H05K3/284 ,  H05K3/3442

Abstract: An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.

公开(公告)号：US20220310317A1

公开(公告)日：2022-09-29

申请号：US17806748

申请日：2022-06-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Minoru KOMIYAMA ,  Motohiko KUSUNOKI ,  Mitsuo ISHIDO ,  Toru KOMATSU

IPC: H01F27/29 ,  H05K3/46 ,  H01F27/28

Abstract: An electronic component module includes a substrate with a first main surface and a second main surface. Mount electronic components and a second conductive member are mounted on the second main surface, and the second conductive member is disposed between the mount electronic component and the mount electronic component. The second conductive member is connected to a shield film disposed near the second main surface through a depression. Mount electronic components and a first conductive member are mounted on the first main surface, and the first conductive member is disposed between the mount electronic component and the mount electronic component. The first conductive member is connected to a shield film disposed near the first main surface through a depression.

公开(公告)号：US20220028750A1

公开(公告)日：2022-01-27

申请号：US17498389

申请日：2021-10-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Motohiko KUSUNOKI ,  Osamu YAMAGUCHI ,  Shinichiro BANBA ,  Takafumi KUSUYAMA

IPC: H01L23/29 ,  H01L23/40 ,  H01L23/552 ,  H01L25/18 ,  H01L23/367 ,  H01L25/07

Abstract: An electronic component module is provided that includes a substrate, an electronic component, a heat dissipating member, and a sealing resin. The electronic component is mounted on the substrate. The heat dissipating member includes a flat plate and columnar bodies. The sealing resin covers a side of a first main surface of the substrate and the electronic component. Moreover, the heat dissipating member, except for a top surface of the flat plate, is covered with the sealing resin. The columnar bodies are disposed at an outer peripheral of the flat plate, and have a shape protruding from a bottom surface of the flat plate. The columnar bodies include a root connected to the flat plate, and a tip connected to the substrate. In a plan view of the electronic component module, the tip is not outside the root.

公开(公告)号：US20200043865A1

公开(公告)日：2020-02-06

申请号：US16524496

申请日：2019-07-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Motohiko KUSUNOKI

IPC: H01L23/552 ,  H01L23/31 ,  H03F3/04 ,  H01L25/16

Abstract: A module includes a substrate having a main surface, a first component mounted on the main surface, and a first wire group constituted of three or more wires in parallel with each other that are bonded to the main surface so as to straddle the first component while extending in a first direction. When sections are defined along a second direction perpendicular to the first direction, the first wire group includes a first section in which a distance between wires adjacent to each other is a first length and a second section in which a distance between wires adjacent to each other is a second length longer than the first length.

公开(公告)号：US20230319977A1

公开(公告)日：2023-10-05

申请号：US18328323

申请日：2023-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota SATO ,  Motohiko KUSUNOKI ,  Tadashi NOMURA

IPC: H05K1/02 ,  H05K1/14 ,  H05K9/00 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/147 ,  H05K9/0084 ,  H05K1/185 ,  H05K2201/0707

Abstract: To provide circuit module capable of shielding electromagnetic wave passing not only on side of electronic component but also below electronic component. Circuit module according to present disclosure includes main board, one first electronic component mounted on main board, and submodule mounted on main board. Submodule includes sub board, and second electronic component. Sub board includes bottom plate mounted on main board, and side plate extending upward from bottom plate. Second electronic component is mounted upper surface of bottom plate. Shield pattern are formed on lower surface of bottom plate, and outer side surface of side plate.

公开(公告)号：US20220199568A1

公开(公告)日：2022-06-23

申请号：US17654424

申请日：2022-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Motohiko KUSUNOKI

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across both the first component and the second component. The wire has one end and the other end that are both connected to the first surface, and the wire is grounded. As seen in a direction perpendicular to the first surface, the first component is located closer to the one end than the second component, a portion of the wire that is furthest from the first surface is located closer to the one end than to the other end, and the second component has an upper surface located lower than an upper surface of the first component.

公开(公告)号：US20220173085A1

公开(公告)日：2022-06-02

申请号：US17651273

申请日：2022-02-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Motohiko KUSUNOKI ,  Takanori UEJIMA

IPC: H01L25/16 ,  H01L23/552

Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.

公开(公告)号：US20210066237A1

公开(公告)日：2021-03-04

申请号：US17095940

申请日：2020-11-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Motohiko KUSUNOKI

IPC: H01L23/00 ,  H01L23/02 ,  H01L23/28 ,  H01L23/552

Abstract: Provided is a high-frequency module capable of enhancing its shielding performance by reducing a placement interval of bonding wires at a desired position using a plurality of bonding wires different in arc height when a shield member is formed using the bonding wires. A high-frequency module includes a multilayer wiring board, components mounted on an upper surface of the multilayer wiring board, a shield member disposed along the component, a sealing resin layer, and a shield film. The shield member is formed of a plurality of bonding wires different in arc height. When the bonding wires are disposed by allowing a bonding wire having a high arc height to sequentially straddle a bonding wire having a low arc height in a nested manner, a placement interval of the bonding wires at a desired position can be reduced and shielding performance can be enhanced.