公开(公告)号：US20240170356A1

公开(公告)日：2024-05-23

申请号：US18426645

申请日：2024-01-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuo ISHIDO ,  Minoru KOMIYAMA ,  Ryota SATO

IPC: H01L23/31 ,  H01L25/065

CPC classification number: H01L23/3121 ,  H01L25/0652

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin that seals at least a part of the first surface and at least a side surface of the first component; and a shield film that is grounded and covers a surface of the first sealing resin on a side farther from the substrate. A surface of the first component on a side farther from the substrate is exposed from the first sealing resin. When the surface of the first component that is exposed from the first sealing resin is defined as a first exposed surface, the first exposed surface has a region covered with the shield film, the region including a strip-shaped portion that is locally reduced in surface roughness.

公开(公告)号：US20230319977A1

公开(公告)日：2023-10-05

申请号：US18328323

申请日：2023-06-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryota SATO ,  Motohiko KUSUNOKI ,  Tadashi NOMURA

IPC: H05K1/02 ,  H05K1/14 ,  H05K9/00 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/147 ,  H05K9/0084 ,  H05K1/185 ,  H05K2201/0707

Abstract: To provide circuit module capable of shielding electromagnetic wave passing not only on side of electronic component but also below electronic component. Circuit module according to present disclosure includes main board, one first electronic component mounted on main board, and submodule mounted on main board. Submodule includes sub board, and second electronic component. Sub board includes bottom plate mounted on main board, and side plate extending upward from bottom plate. Second electronic component is mounted upper surface of bottom plate. Shield pattern are formed on lower surface of bottom plate, and outer side surface of side plate.