公开(公告)号：US20220238455A1

公开(公告)日：2022-07-28

申请号：US17659389

申请日：2022-04-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuo ISHIDO ,  Motohiko KUSUNOKI ,  Minoru KOMIYAMA

IPC: H01L23/552 ,  H01L25/16 ,  H01L23/498

Abstract: A module includes a substrate having a first surface, a first component and a second component that are mounted on the first surface, a first conductive material mounted between the first component and the second component, a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material, and a first shield film that covers the first sealing resin, in which the first sealing resin has a recess to expose at least a part of the first conductive material, the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material, the first shield film is provided with an opening in the recess, a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening.

公开(公告)号：US20230163086A1

公开(公告)日：2023-05-25

申请号：US18056307

申请日：2022-11-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Minoru KOMIYAMA ,  Tadashi NOMURA ,  Yoshihito OTSUBO ,  Toru KOMATSU

IPC: H01L23/66 ,  H01L23/498 ,  H05K9/00 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L23/49811 ,  H05K9/0049 ,  H01L23/31 ,  H05K9/0084

Abstract: A module comprises: a substrate having a first surface; a first component and a second component mounted on the first surface; a conductive member mounted therebetween; and a resin seal disposed to cover the first surface, the first component and the second component and also seal a portion of the conductive member. The resin seal has a recess that exposes at least a portion of the conductive member, and inside the recess the resin seal and the conductive member have a side surface and a surface, respectively, covered with a first shield film. The first shield film inside the recess is covered with a second shield film smaller in thickness than the first shield film. The resin seal has a surface facing away from the first surface and covered with the second shield film.

公开(公告)号：US20220310317A1

公开(公告)日：2022-09-29

申请号：US17806748

申请日：2022-06-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Minoru KOMIYAMA ,  Motohiko KUSUNOKI ,  Mitsuo ISHIDO ,  Toru KOMATSU

IPC: H01F27/29 ,  H05K3/46 ,  H01F27/28

Abstract: An electronic component module includes a substrate with a first main surface and a second main surface. Mount electronic components and a second conductive member are mounted on the second main surface, and the second conductive member is disposed between the mount electronic component and the mount electronic component. The second conductive member is connected to a shield film disposed near the second main surface through a depression. Mount electronic components and a first conductive member are mounted on the first main surface, and the first conductive member is disposed between the mount electronic component and the mount electronic component. The first conductive member is connected to a shield film disposed near the first main surface through a depression.

公开(公告)号：US20240170356A1

公开(公告)日：2024-05-23

申请号：US18426645

申请日：2024-01-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuo ISHIDO ,  Minoru KOMIYAMA ,  Ryota SATO

IPC: H01L23/31 ,  H01L25/065

CPC classification number: H01L23/3121 ,  H01L25/0652

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin that seals at least a part of the first surface and at least a side surface of the first component; and a shield film that is grounded and covers a surface of the first sealing resin on a side farther from the substrate. A surface of the first component on a side farther from the substrate is exposed from the first sealing resin. When the surface of the first component that is exposed from the first sealing resin is defined as a first exposed surface, the first exposed surface has a region covered with the shield film, the region including a strip-shaped portion that is locally reduced in surface roughness.