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公开(公告)号：US20240040760A1
公开(公告)日：2024-02-01
申请号：US18265597
申请日：2021-11-23
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Chao Yang , Yuan Zhao , Zhiyong Xu , Ju Le Sun
CPC classification number: H05K9/0084 , H05K1/0216 , H05K3/241 , H05K2201/0707
Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17. The electromagnetic shielding film is attached to the electronic component of a system-in-package module by means of a 3D formation process, and has good electromagnetic shielding performance. The circuit board to which the 3D formed electromagnetic shielding film is attached is suitable for a wave soldering process or a reflow soldering process in a subsequent manufacturing procedure, and the reflow soldering process does not cause any damage to the electromagnetic shielding film.
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公开(公告)号：US11775119B1
公开(公告)日：2023-10-03
申请号：US17224756
申请日：2021-04-07
Applicant: Amazon Technologies, Inc.
Inventor： Fubin Song , Chaoran Yang , Shoubao Wang , Lixin Wu , Cheng Xue
CPC classification number: G06F3/044 , G06F1/182 , H05K1/023 , H05K9/0064 , G06F2203/04107 , H05K9/0071 , H05K2201/0707 , H05K2201/10151
Abstract: Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.
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3.发明申请公开(公告)号：US20180192515A1
公开(公告)日：2018-07-05
申请号：US15900473
申请日：2018-02-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： Krishna K. Uprety , Khushroo H. Lakdawala , Alexander Bimanand
IPC: H05K1/09 , H05B3/84 , B32B27/40 , B32B27/36 , B32B27/30 , B32B27/28 , B32B27/08 , B32B17/10 , B32B15/20 , B32B15/095 , B32B15/09 , B32B15/082 , B32B15/08 , B32B3/16 , B32B3/14 , B32B3/08
CPC classification number: H05K1/092 , B32B3/08 , B32B3/14 , B32B3/16 , B32B15/08 , B32B15/082 , B32B15/09 , B32B15/095 , B32B15/20 , B32B17/10 , B32B17/10018 , B32B17/10192 , B32B17/1022 , B32B17/10761 , B32B17/1077 , B32B17/10798 , B32B27/08 , B32B27/28 , B32B27/30 , B32B27/36 , B32B27/365 , B32B27/40 , B32B2307/202 , B32B2307/412 , B32B2369/00 , B32B2375/00 , B32B2605/006 , B32B2605/08 , B32B2605/18 , G02F1/155 , H05B3/84 , H05B2203/002 , H05B2203/013 , H05B2203/017 , H05K1/0274 , H05K1/0296 , H05K1/0353 , H05K2201/0707 , Y10T156/10 , B32B2367/00
Abstract: A transparency including a conductive mesh is disclosed. The conductive mesh is formed by a plurality of inkjet printed electrically conductive lines on a polymer film or a glass, polyacrylate, polycarbonate, or polyurethane substrate, wherein at least one inkjet printed electrically conductive line intersects at least one other inkjet printed electrically conductive line. A flying vehicle including a transparency including a conductive mesh is also disclosed. Additionally, a method of preparing a transparency by laminating a polymer film and a substrate together, wherein a conductive mesh is formed on the polymer film by a plurality of inkjet printed electrically conductive lines, is also disclosed.
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公开(公告)号：US09924608B2
公开(公告)日：2018-03-20
申请号：US15284690
申请日：2016-10-04
Applicant: PEGATRON CORPORATION
Inventor： Yao-Zheng Lin , Yu-Chun Chang
CPC classification number: H05K7/1439 , H05K1/0216 , H05K1/111 , H05K1/141 , H05K9/0015 , H05K9/006 , H05K2201/0707 , H05K2201/10386
Abstract: A circuit board assembly includes a main board, a daughter board, a metal bracket, and a conductive gasket. The daughter board includes a circuit board and an electronic module with a plurality of pins connected to the circuit board. The metal bracket clamps at one side of the circuit board and the electronic module to shield the plurality of pins. The metal bracket has a connection part connecting the main board. The conductive gasket is disposed between the metal bracket and the plurality of pins.
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公开(公告)号：US09888619B2
公开(公告)日：2018-02-06
申请号：US14414514
申请日：2013-06-05
Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
Inventor： Yusuke Haruna , Sirou Yamauchi , Hiroshi Tajima , Kenji Kamino
CPC classification number: H05K9/0088 , B32B7/12 , B32B15/04 , B32B15/20 , B32B2307/202 , B32B2307/206 , B32B2457/00 , H05K1/0215 , H05K1/0216 , H05K1/0218 , H05K1/0296 , H05K2201/0154 , H05K2201/0338 , H05K2201/0347 , H05K2201/0355 , H05K2201/0707 , H05K2201/0715 , H05K2203/072 , H05K2203/0723
Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.
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Patent Agency Ranking
公开(公告)号：US09888561B2
公开(公告)日：2018-02-06
申请号：US14804486
申请日：2015-07-21
Applicant: Apple Inc.
Inventor： Ryan C. Perkins , Trevor J. Ness , Tyler S. Bushnell , Steven P. Cardinali
IPC: H05K1/16 , H05K1/02 , H01L23/60 , H05K1/18 , H05K7/00 , H05K9/00 , H01L31/048 , H01L23/00 , H01L23/28 , H05K1/14 , H05K3/28
CPC classification number: H05K1/0218 , H01L23/28 , H01L23/564 , H01L23/60 , H01L31/048 , H01L2224/16225 , H01L2924/181 , H05K1/147 , H05K1/167 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0133 , H05K2201/0707 , H05K2201/10098 , H05K2201/10151 , H05K2201/10371 , H05K2201/10977 , H05K2203/1316 , H01L2924/00012
Abstract: Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.
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公开(公告)号：US09847267B2
公开(公告)日：2017-12-19
申请号：US14904771
申请日：2014-11-18
Applicant: KYOCERA Corporation
Inventor： Noritaka Niino
IPC: H05K7/00 , H05K1/18 , H01L23/053 , H01L23/057 , H01L23/10 , H01L21/50 , H03H9/10 , H01L23/08 , H01L41/053 , H05K9/00 , H05K5/00 , H05K1/02
CPC classification number: H01L23/053 , H01L21/50 , H01L23/057 , H01L23/08 , H01L23/10 , H01L41/053 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H03H9/1014 , H03H9/1071 , H05K1/0218 , H05K1/0224 , H05K1/183 , H05K9/0024 , H05K9/0052 , H05K9/0071 , H05K9/0098 , H05K2201/0707 , H05K2201/09036 , H05K2201/10371 , H01L2924/00014
Abstract: An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.
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8.发明授权Transparent laminates comprising inkjet printed conductive lines and methods of forming the same 有权包括喷墨印刷导电线的透明层压板及其形成方法公开(公告)号：US09302452B2
公开(公告)日：2016-04-05
申请号：US13411476
申请日：2012-03-02
Applicant: Krishna K. Uprety , Khushroo H. Lakdawala , Alexander Bimanand
Inventor： Krishna K. Uprety , Khushroo H. Lakdawala , Alexander Bimanand
IPC: B32B37/14 , B32B37/06 , H05B3/84 , B32B27/08 , B32B15/08 , B32B15/082 , B32B15/09 , B32B15/095 , B32B15/20 , B32B17/10 , B32B27/28 , B32B27/30 , B32B27/36 , B32B27/40 , B32B3/08 , B32B3/14 , B32B3/16 , B64C1/14 , H01R13/20
CPC classification number: H05K1/092 , B32B3/08 , B32B3/14 , B32B3/16 , B32B15/08 , B32B15/082 , B32B15/09 , B32B15/095 , B32B15/20 , B32B17/10 , B32B17/10018 , B32B17/10192 , B32B17/1022 , B32B17/10761 , B32B17/1077 , B32B17/10798 , B32B27/08 , B32B27/28 , B32B27/30 , B32B27/36 , B32B27/365 , B32B27/40 , B32B2307/202 , B32B2307/412 , B32B2369/00 , B32B2375/00 , B32B2605/006 , B32B2605/08 , B32B2605/18 , G02F1/155 , H05B3/84 , H05B2203/002 , H05B2203/013 , H05B2203/017 , H05K1/0274 , H05K1/0296 , H05K1/0353 , H05K2201/0707 , Y10T156/10 , B32B2367/00
Abstract: A transparency including a conductive mesh is disclosed. The conductive mesh is formed by a plurality of inkjet printed electrically conductive lines on a polymer film or a glass, polyacrylate, polycarbonate, or polyurethane substrate, wherein at least one inkjet printed electrically conductive line intersects at least one other inkjet printed electrically conductive line. A flying vehicle including a transparency including a conductive mesh is also disclosed. Additionally, a method of preparing a transparency by laminating a polymer film and a substrate together, wherein a conductive mesh is formed on the polymer film by a plurality of inkjet printed electrically conductive lines, is also disclosed.
Abstract translation: 公开了包括导电网的透明体。 导电网由聚合物膜或玻璃，聚丙烯酸酯，聚碳酸酯或聚氨酯基底上的多个喷墨印刷的导电线形成，其中至少一个喷墨印刷导电线与至少一个其它喷墨印刷的导电线相交。 还公开了一种包括具有导电网的透明体的飞行器。 此外，还公开了通过将聚合物膜和基板层合在一起来制备透明体的方法，其中通过多个喷墨印刷的导电线在聚合物膜上形成导电网。
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公开(公告)号：US20150289361A1
公开(公告)日：2015-10-08
申请号：US14739703
申请日：2015-06-15
Applicant: International Business Machines Corporation
Inventor： Daniel C. Edelstein , David V. Horak , Elbert E. Huang , Satyanarayana V. Nitta , Takeshi Nogami , Shom Ponoth , Terry A. Spooner
CPC classification number: H05K1/0216 , H01L21/7682 , H01L21/76832 , H01L21/76834 , H01L21/76849 , H01L21/76852 , H05K1/0298 , H05K1/03 , H05K2201/0707 , H05K2201/09063
Abstract: A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure.
Abstract translation: 微电子结构和微电子结构的制造方法提供插入在多个导体层之间的多个空隙。 多个空隙也位于衬垫层和层间电介质层之间。 空隙提供了微电子结构的增强的电性能。
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公开(公告)号：US09114254B2
公开(公告)日：2015-08-25
申请号：US14094654
申请日：2013-12-02
Applicant: Youngtack Shim
Inventor： Youngtack Shim
CPC classification number: A61N1/16 , H05K9/0054 , H05K9/0071 , H05K2201/0707
Abstract: The present invention relates to an electromagnetically-countered display system including at least one wave source and at least one counter unit, where such a wave source irradiates harmful electromagnetic waves and the counter unit emits counter electromagnetic waves for countering the harmful waves therewith. More particularly, the present invention relates to various counter units for the electromagnetically-countered display system and to various mechanisms to counter the harmful waves with the counter units, e.g., by matching configurations of the counter units with those of the wave sources, by matching wavefronts of the harmful waves with those the counter waves, and so on. The present invention also relates to various methods of countering the harmful waves with such counter waves by source and/or wave matchings, various methods of providing the counter units for emitting the counter waves defining desired wave characteristics, and the like. The present invention further relates to various processes for providing the electromagnetically-countered display systems and their counter units. The present invention further relates to various electric and magnetic shields employed either alone or in conjunction with the counter units for minimizing irradiation of the harmful waves from the shaving system.
Abstract translation: 本发明涉及一种电磁反射显示系统，其包括至少一个波源和至少一个计数器单元，其中这种波源照射有害的电磁波，并且该计数器单元发射反电磁波以抵抗有害波。 更具体地，本发明涉及用于电磁反射显示系统的各种计数器单元以及用于通过与计数器单元对抗有害波的各种机制，例如通过匹配计数器单元与波源的配置，通过匹配 有波浪的波浪与那些反浪，等等。 本发明还涉及通过源和/或波匹配来对抗有害波的各种方法，提供用于发射限定所需波特性的反波的计数器单元的各种方法等。 本发明还涉及用于提供电磁反射显示系统及其计数器单元的各种方法。 本发明还涉及单独使用或与计数器单元结合使用的各种电磁屏蔽件，用于最小化来自剃刮系统的有害波的照射。
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