公开(公告)号：US20240284591A1

公开(公告)日：2024-08-22

申请号：US18650918

申请日：2024-04-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tsuyoshi TAKAKURA ,  Masaaki MIZUSHIRO ,  Satoshi IZUMI ,  Ryuichiro WADA ,  Hiroki YOSHIMORI ,  Yoshihito OTSUBO ,  Tadashi NOMURA

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0367 ,  H05K2201/0391

Abstract: A circuit module includes: a substrate including a first main surface and a second main surface; a resin layer on the first main surface of the substrate; an electronic component; a penetrating portion penetrating the resin layer in a thickness direction; a first conductor that is a pillar conductor present in the penetrating portion, the first conductor including a first bottom closer to the substrate and a second bottom inward of an outer surface of the resin layer; a second conductor that is a metal film covering at least a portion of a side surface of the first conductor, the second conductor including a portion extending continuously from the side surface of the first conductor to the same plane with the outer surface of the resin layer.