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公开(公告)号：US20130069481A1
公开(公告)日：2013-03-21
申请号：US13674114
申请日：2012-11-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsuya KIMURA , Yasuyuki IDA , Mari SAJI
IPC: H01L41/107
CPC classification number: H01L41/107 , H03H9/14541
Abstract: A surface acoustic wave device includes a piezoelectric substrate including a groove located in a surface thereof, an IDT electrode, and a dielectric film. The IDT electrode includes a first electrode layer located in the groove and a second electrode layer located outside the groove. The dielectric film is arranged on the piezoelectric substrate so as to cover the IDT electrode. The second electrode layer is tapered toward a side opposite to the piezoelectric substrate.
Abstract translation: 表面声波装置包括压电基板，其包括位于其表面中的凹槽，IDT电极和电介质膜。 IDT电极包括位于槽中的第一电极层和位于槽外部的第二电极层。 电介质膜设置在压电基板上以覆盖IDT电极。 第二电极层朝向与压电基板相反的一侧逐渐变细。
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公开(公告)号：US20190199324A1
公开(公告)日：2019-06-27
申请号：US16212801
申请日：2018-12-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Katsuya MATSUMOTO , Yasuyuki IDA
CPC classification number: H03H9/545 , H01L41/1873 , H03H9/05 , H03H9/0547 , H03H9/1064 , H03H9/13 , H03H9/205 , H03H9/70
Abstract: A composite electronic component includes a first acoustic wave filter, a second acoustic wave filter, a spacer layer, and a switch. The second acoustic wave filter faces the first acoustic wave filter in a first direction. The switch switches an ON state and an OFF state of the first acoustic wave filter and an ON state and an OFF state of the second acoustic wave filter. A first functional electrode and a second functional electrode are located in a hollow space and face each other in the first direction. The switch brings at least one of the first acoustic wave filter and the second acoustic wave filter into the OFF state.
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公开(公告)号：US20170194933A1
公开(公告)日：2017-07-06
申请号：US15465630
申请日：2017-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yutaka KISHIMOTO , Yasuyuki IDA , Hideaki KOBAYASHI
IPC: H03H9/17
CPC classification number: H03H9/173 , H03H3/02 , H03H9/02228 , H03H9/0547 , H03H9/175
Abstract: A piezoelectric module includes a piezoelectric thin film, a fixing layer, and a support substrate. The piezoelectric thin film is supported by the support substrate with the fixing layer in between. Functional conductors are provided on a surface of the piezoelectric thin film. A void is provided in the fixing layer to include a region overlapping with the functional conductors. A conductor pattern defining a circuit element is provided in a region of the void on a surface of the support substrate on the fixing layer side.
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