公开(公告)号：US20230189490A1

公开(公告)日：2023-06-15

申请号：US18166661

申请日：2023-02-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shota Hayashi ,  Nobuaki Ogawa ,  Yuki Asano ,  Akihiro Muranaka ,  Takanori Uejima ,  Hiromichi Katajima ,  Takahiro Eguchi

IPC: H05K9/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/552 ,  H01L21/56 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K9/0022 ,  H01L25/0655 ,  H01L25/165 ,  H01L23/552 ,  H05K9/0039 ,  H01L21/56 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2203/025 ,  H05K2203/1316

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

公开(公告)号：US11349449B2

公开(公告)日：2022-05-31

申请号：US17144559

申请日：2021-01-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei Yamamoto ,  Atsunobu Okazaki ,  Yuki Asano

IPC: H03H7/01 ,  H03H1/00 ,  H03H3/00

Abstract: Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.