Antenna-mounted substrate and antenna module

    公开(公告)号:US11196177B2

    公开(公告)日:2021-12-07

    申请号:US16867140

    申请日:2020-05-05

    Inventor: Issei Yamamoto

    Abstract: An antenna-mounted substrate includes a first patch antenna, a second patch antenna disposed to face one principal surface of the first patch antenna, and a ground electrode disposed to face the other principal surface of the first patch antenna, the antenna-mounted substrate further including an antenna holding layer holding the second patch antenna, an inter-antenna layer positioned between the first patch antenna and the second patch antenna, and a substrate layer positioned between the first patch antenna and the ground electrode, those three layers being positioned in the mentioned order, wherein the inter-antenna layer is made of a dielectric material, and a relation of εr3>εr1≥εr2 is satisfied on an assumption that a relative permittivity of the antenna holding layer is denoted by εr1, a relative permittivity of the inter-antenna layer is denoted by εr2, and a relative permittivity of the substrate layer is denoted by εr3.

    LAMINATED SUBSTRATE
    3.
    发明申请
    LAMINATED SUBSTRATE 审中-公开

    公开(公告)号:US20200305272A1

    公开(公告)日:2020-09-24

    申请号:US16895444

    申请日:2020-06-08

    Abstract: A laminated substrate that includes a substrate body having a plurality of laminated ceramic layers containing a first glass; a wiring conductor within the substrate body and made from silver, copper, a silver alloy, or a copper alloy; and a thermal conductor within or on a main surface of the substrate body. The thermal conductor is at least one of (1) a thermal via penetrating a part of a first ceramic layer of the plurality of laminated ceramic layers in a thickness direction thereof, and (2) a heat spreader extending along a main surface of the first ceramic layer of the plurality of laminated ceramic layers. A first thermal conductivity of the thermal conductor is higher than a second thermal conductivity of the first ceramic layer, and the thermal conductor contains an insulating ceramic as a main material thereof, and further contains a second glass.

    ESD protection device and method for manufacturing the same
    4.
    发明授权
    ESD protection device and method for manufacturing the same 有权
    ESD保护装置及其制造方法

    公开(公告)号:US08779466B2

    公开(公告)日:2014-07-15

    申请号:US13765719

    申请日:2013-02-13

    Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.

    Abstract translation: 制造ESD保护装置,使其ESD特性容易调节和稳定。 ESD保护装置包括绝缘基板,设置在绝缘基板中的空腔,至少一对放电电极,每一对放电电极各自包括暴露在空腔中的部分,暴露部分彼此相对布置,外部电极设置在表面上 并连接到所述至少一对放电电极。 具有导电性的颗粒状支撑电极材料分散在空腔中的至少一对放电电极的露出部分之间。

    Antenna-attached substrate and antenna module

    公开(公告)号:US11658405B2

    公开(公告)日:2023-05-23

    申请号:US16896378

    申请日:2020-06-09

    CPC classification number: H01Q1/40 H01Q23/00

    Abstract: An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

    Module
    7.
    发明授权
    Module 有权

    公开(公告)号:US11121054B2

    公开(公告)日:2021-09-14

    申请号:US16508788

    申请日:2019-07-11

    Abstract: A module improves a heat-releasing effect and that can be stably mounted on a mother substrate or the like. The module includes: a first component mounted on one main surface of a wiring substrate and generates heat; second components mounted on the one main surface of the wiring substrate; a sealing resin layer that seals the first component and the second components so as not to cover a top surface of the first component; and heat-dissipating parts arranged on the top surface of the first component. The height of the highest positions of the heat-dissipating parts relative to the one main surface is less than or equal to the position of a highest surface out of a surface of the sealing resin layer that is on the opposite side from the surface of the sealing resin layer that faces the one main surface.

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