摘要:
A control valve comprises a valve body having a fluid channel and a valve seat; a valve operating part; a valve stem supporting member having its upper end fixed to the valve operating part and its lower end fixed to the valve body; a valve stem penetrating the valve stem supporting member and having its upper end part connected to the valve operating part and its lower end part entering the valve body, the valve stem being movable upward or downward by the valve operating part; and a valve element attached to the lower end of the valve stem. The valve element is moved upward or downward by moving the valve stem upward or downward, the valve element being brought into contact with and seated in the valve seat to close a fluid channel as it is moved downward, the valve element being detached from the valve seat to open the fluid channel as it is moved upward. The valve stem supporting member has an upper tubular body and a lower tubular body, the upper tubular body having its upper end fixed to the valve operating part and its lower end detached from the valve body, the lower tubular body having its lower end fixed to the valve body and its upper end detached from the valve operating part, the two tubular bodies being spaced apart each other, the lower end part of the upper tubular body and the upper end part of the lower tubular body being connected by a connecting member.
摘要:
An actuator comprises a valve case opened upward, a gas-driven actuator having a fixed portion provided on the valve case and fixed thereto and an operating portion movable upward and downward by a drive gas when the gas flows in or out, a valve stem extending upward from inside the valve case to above the case and having its upper end fixed to the operating portion of the actuator, and a valve element provided on the lower end of the valve stem. A valve case fluid seal bellows and an actuator gas seal bellows are connected between the valve stem and the actuator fixed portion and between the actuator fixed portion and operating portion, respectively. A vacuum is contained in a closed space formed by the valve stem, fluid seal bellows, actuator fixed portion, gas seal bellows and actuator operating portion. The variations in the internal pressure of the closed space due to variations in the ambient temperature are much smaller than the pressure of the drive gas, so that the flow rate of fluid remains unchanged by the variations in the ambient temperature.
摘要:
A metal diaphragm type valve includes a valve seat holder supported from a rotatable valve stem, a metal diaphragm and a deflection limiter. The valve seat holder has a shaft extending upwardly through central openings in the diaphragm and the deflection limiter. A diaphragm support step having an annular flat surface joining an arcuate shoulder is provided around the shaft of the valve seat holder and the inner peripheral edge of the diaphragm rests on the flat surface. The deflection limiter has a flat bottom surface facing the top surface of the diaphragm and an arcuate surface extends radially outwardly from the flat bottom surface. The deflection limiter, diaphragm and valve seat holder are welded together by a weld extending through the flat bottom portion of the deflection limiter and the inner peripheral edge of the diaphragm to the flat surface on the seat holder, the weld forming an air-tight seal between the valve chamber and the passage for the shaft. The radial dimensions of the flat surfaces are different so that bending stresses occur in different regions of the diaphragm depending on whether the valve is opened or closed.
摘要:
A tightening tool comprises a head having a socket for a nut to fit in, a head support supporting the head rotatably about the axis of the socket, and a handle integral with the head support. A magnet is attached to each of the head and the head support. The head and the head support are joined together by a force of attraction permitting these portions to rotate relative to each other upon the torque of tightening up the nut reaching a proper value. When the head support is rotated by turning the handle by hand, the head moves with the head support to tighten the nut. After the nut tightening torque has reached the proper value, the head support merely rotates idly with the head and the nut remaining unrotated even if the handle is turned.
摘要:
On an etching target film formed on a substrate, a three-layer resist is laminated. This three-layer resist includes an organic film and a resist film developed into a resist pattern. Through the resist pattern, the organic film is etched into a mask pattern through which the etching target film will be etched.The organic film is etched with plasma which is obtained by exciting a process gas containing carbon dioxide and hydrogen to the plasma state. This scheme makes it possible to form a high perpendicularity mask pattern in the organic film.
摘要:
The present invention is a method of etching a lower layer film (64) of an organic material formed on a surface layer (61) of a substrate, using an upper layer film (63) of an Si-containing organic material as a mask. A mixed gas containing an NH3 gas and an O2 gas is supplied into the processing vessel as an etching gas, so as to perform etching by a plasma of the etching gas. When the etching gas is supplied into the processing vessel, a CD shift value of etching can be controlled by adjusting a flow ratio of O2 gas to the NH3 gas. Specifically, a satisfactory CD shift value can be obtained when the flow ratio is from 0.5 to 20%, and preferably, 5 to 10%.
摘要:
[Object] It is an object of the present invention to provide a semiconductor device manufacturing method capable of forming a high perpendicularity mask pattern, which is laminated on an etching target film on a substrate, through a resist pattern formed from a resist film laminated on the organic film, for use as an etching mask for the etching target film.[Means for Solving the Problem] There is provided a step of etching an organic film in a multi-layered resist laminated on an etching target film on a substrate, the multi-layered resist including the organic film and a resist film having a resist pattern laminated on the organic film, by a plasma, which has been obtained by making a process gas containing carbon dioxide and hydrogen, along the resist pattern, so as to form a mask pattern for etching the etching target film.
摘要:
On a surface of a semiconductor wafer W, a SiCN film, a SiCOH film, a TEOS film, an antireflection film, and a resist film (ArF resist) as a mask are formed in turn. A via hole is formed by plasma etching the SiCOH film with a predetermined etching gas comprising a mixed gas, for example, CF4/CH2F2/N2/O2 mixed gas (not containing a rare gas such as an Ar gas). Thereby, the selection ratio between a low dielectric constant insulation film comprising a carbon containing silicon oxide and the resist can be improved. And at the same time, even when the hole has a minute diameter and a high aspect ratio, an inner wall surface of the hole can be formed in a satisfactory state.
摘要:
On a surface of a semiconductor wafer W, a SiCN film, a SiCOH film, a TEOS film, an antireflection film, and a resist film (ArF resist) as a mask are formed in turn. A via hole is formed by plasma etching the SiCOH film with a predetermined etching gas comprising a mixed gas, for example, CF4/CH2F2/N2/O2 mixed gas (not containing a rare gas such as an Ar gas). Thereby, the selection ratio between a low dielectric constant insulation film comprising a carbon containing silicon oxide and the resist can be improved. And at the same time, even when the hole has a minute diameter and a high aspect ratio, an inner wall surface of the hole can be formed in a satisfactory state.