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    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130135788A1

    公开(公告)日：2013-05-30

    申请号：US13569703

    申请日：2012-08-08

    申请人： Myung Jun PARK ,  Kyu Ha Lee ,  Da Young Choi ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    发明人： Myung Jun PARK ,  Kyu Ha Lee ,  Da Young Choi ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    IPC分类号： H01G4/005

    CPC分类号： H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    摘要： There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：陶瓷主体，包括电介质层，具有第一和第二主面，沿长度方向相对的第三和第四侧面以及沿宽度方向相对的第五和第六面; 第一和第二内部电极; 以及形成在第五面上的一个或多个第一外部电极和形成在第六面上的一个或多个第二外部电极，其中第一和第二外部电极的平均厚度范围为3μm至30μm，并且当至少一个 第一外部电极和第二外部电极在厚度方向上分成三个相等的部分，其中心区域部分的玻璃面积为中心区域部分总面积的35％至80％。

    Multilayer ceramic electronic component
    2.
    发明授权
    Multilayer ceramic electronic component 有权
    多层陶瓷电子元件

    公开(公告)号：US08941972B2

    公开(公告)日：2015-01-27

    申请号：US13572407

    申请日：2012-08-10

    申请人： Myung Jun Park ,  Sang Hoon Kwon ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Da Young Choi ,  Kyu Ha Lee ,  Byung Jun Jeon

    发明人： Myung Jun Park ,  Sang Hoon Kwon ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Da Young Choi ,  Kyu Ha Lee ,  Byung Jun Jeon

    IPC分类号： H01G4/30 ,  H01B3/12 ,  H01G4/12 ,  H01G4/232

    CPC分类号： H01B3/12 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/417

    摘要： There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

    摘要翻译： 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括：陶瓷体，其包括电介质层; 第一和第二内部电极设置在陶瓷体内以彼此面对，同时介于其间的电介质层; 以及第一外部电极，电连接到形成在第一外部电极上的第一和第二内部电极和第二外部电极，其中第一和第二外部电极包括导电金属和玻璃，并且当第二外部电极被分成三个相等部分 在厚度方向上，中央部分的玻璃的面积相对于中央部的面积为30〜80％。 因此，提高了芯片的密封性，可以实现具有提高的可靠性的多层陶瓷电子部件。

    Multilayer ceramic electronic component and fabrication method thereof
    3.
    发明授权
    Multilayer ceramic electronic component and fabrication method thereof 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US08941971B2

    公开(公告)日：2015-01-27

    申请号：US13569703

    申请日：2012-08-08

    申请人： Myung Jun Park ,  Kyu Ha Lee ,  Da Young Choi ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    发明人： Myung Jun Park ,  Kyu Ha Lee ,  Da Young Choi ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    IPC分类号： H01G4/30

    CPC分类号： H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    摘要： There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：陶瓷主体，包括电介质层，具有第一和第二主面，沿长度方向相对的第三和第四侧面以及沿宽度方向相对的第五和第六面; 第一和第二内部电极; 以及形成在第五面上的一个或多个第一外部电极和形成在第六面上的一个或多个第二外部电极，其中第一外部电极和第二外部电极具有3μm至30μm的平均厚度，并且当至少一个 第一外部电极和第二外部电极在厚度方向上分成三个相等的部分，其中心区域部分的玻璃面积为中心区域部分总面积的35％至80％。

    Multilayer ceramic electronic component and method of fabricating the same
    4.
    发明授权
    Multilayer ceramic electronic component and method of fabricating the same 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US08767375B2

    公开(公告)日：2014-07-01

    申请号：US13569738

    申请日：2012-08-08

    申请人： Myung Jun Park ,  Sang Hoon Kwon ,  Jae Young Park ,  Kyu Ha Lee ,  Byung Jun Jeon ,  Da Young Choi ,  Hyun Hee Gu ,  Chang Hoon Kim

    发明人： Myung Jun Park ,  Sang Hoon Kwon ,  Jae Young Park ,  Kyu Ha Lee ,  Byung Jun Jeon ,  Da Young Choi ,  Hyun Hee Gu ,  Chang Hoon Kim

    IPC分类号： H01G4/228 ,  H01G4/30 ,  H01G4/005 ,  H01G4/12

    CPC分类号： H01G4/228 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30

    摘要： There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

    摘要翻译： 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括：陶瓷主体，其包括电介质层; 第一和第二内部电极，其设置成在陶瓷主体内彼此面对; 以及第一外部电极和第二外部电极，其中所述第一和第二外部电极包括导电金属和玻璃，并且当所述第一外部电极和所述第二外部电极中的至少一个在厚度方向上被分成三个相等的部分时， 的中心部分的玻璃的总面积的35％至80％。 具有提高的可靠性的多层陶瓷电子部件可以通过提高芯片气密性来实现。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    5.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20130120898A1

    公开(公告)日：2013-05-16

    申请号：US13572407

    申请日：2012-08-10

    申请人： Myung Jun PARK ,  Sang Hoon Kwon ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Da Young Choi ,  Kyu Ha Lee ,  Byung Jun Jeon

    发明人： Myung Jun PARK ,  Sang Hoon Kwon ,  Chang Hoon Kim ,  Hyun Hee Gu ,  Jae Young Park ,  Da Young Choi ,  Kyu Ha Lee ,  Byung Jun Jeon

    IPC分类号： H01G4/30 ,  H01B1/02 ,  H01G13/00

    CPC分类号： H01B3/12 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/417

    摘要： There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

    摘要翻译： 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括：陶瓷体，其包括电介质层; 第一和第二内部电极设置在陶瓷体内以彼此面对，同时介于其间的电介质层; 以及第一外部电极，电连接到形成在第一外部电极上的第一和第二内部电极和第二外部电极，其中第一和第二外部电极包括导电金属和玻璃，并且当第二外部电极被分成三个相等部分 在厚度方向上，中央部分的玻璃的面积相对于中央部的面积为30〜80％。 因此，提高了芯片的密封性，可以实现具有提高的可靠性的多层陶瓷电子部件。

    Multilayer ceramic electronic component and method of fabricating the same
    6.
    发明授权
    Multilayer ceramic electronic component and method of fabricating the same 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US08837112B2

    公开(公告)日：2014-09-16

    申请号：US13620635

    申请日：2012-09-14

    申请人： Hyun Hee Gu ,  Myung Jun Park ,  Kyu Ha Lee ,  Da Young Choi ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    发明人： Hyun Hee Gu ,  Myung Jun Park ,  Kyu Ha Lee ,  Da Young Choi ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    IPC分类号： H01G4/06 ,  H01G4/30 ,  H01G4/005

    CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  Y10T29/435

    摘要： There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05≦A/B≦0.6 is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 多个内部电极，其设置成在陶瓷体内彼此面对，其间插入介电层; 电连接到内部电极的外部电极，其中陶瓷体包括对应于电容形成部分的有源层和形成在有源层的上表面和下表面中的至少一个上的覆盖层， - 电容形成部分，覆盖层的平均厚度为15μm以下，外部电极包括导电性金属和玻璃，并且当玻璃占据的外部电极的面积为A且其占据面积 导电金属为B，0.05＆nlE; A / B＆NlE; 0.6。

    Multilayer ceramic electronic component
    7.
    发明授权
    Multilayer ceramic electronic component 有权
    多层陶瓷电子元件

    公开(公告)号：US08792223B2

    公开(公告)日：2014-07-29

    申请号：US13620614

    申请日：2012-09-14

    申请人： Hyun Hee Gu ,  Myung Jun Park ,  Kyu Ha Lee ,  Da Young Choi ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    发明人： Hyun Hee Gu ,  Myung Jun Park ,  Kyu Ha Lee ,  Da Young Choi ,  Jae Young Park ,  Sang Hoon Kwon ,  Byung Jun Jeon

    IPC分类号： H01G4/005 ,  H01G4/00

    CPC分类号： H01G4/12

    摘要： There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls≦10 μm is satisfied.

    摘要翻译： 提供了一种多层陶瓷电子部件，其包括：陶瓷体，其包括电介质层; 设置在所述陶瓷体内的多个内部电极，其彼此面对，具有介电层; 电连接到所述多个内部电极的外部电极，其中所述陶瓷体包括对应于电容形成部分的有源层和形成在所述有源层的上表面和下表面中的至少一个上的覆盖层，并且对应于 非电容形成部，覆盖层的平均厚度为15μm以下，外部电极包括导电性金属和玻璃部，当外部电极的长度方向的玻璃部的平均长度为Ls ，Ls＆nlE;满足10μm。