公开(公告)号：US20210403765A1

公开(公告)日：2021-12-30

申请号：US17293327

申请日：2019-07-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Eiichi NOMURA ,  Katsushi KAN ,  Daisuke MORI ,  Yosuke OI ,  Yukio YADA ,  Takashi HIRAOKA ,  Takeyuki KITAGAWA

IPC: C09J7/35 ,  C09J7/10 ,  C09J11/04 ,  B32B9/00 ,  B32B9/04 ,  B32B27/38 ,  B32B27/30 ,  B32B27/36 ,  B32B27/28 ,  B32B27/20 ,  H01L23/29

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

公开(公告)号：US20210084775A1

公开(公告)日：2021-03-18

申请号：US16772643

申请日：2018-12-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Eiichi NOMURA ,  Yutaka MIYAMOTO ,  Takayuki HASHIMOTO

IPC: H05K3/46 ,  H05K1/14

Abstract: A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

公开(公告)号：US20220310546A1

公开(公告)日：2022-09-29

申请号：US17633598

申请日：2020-08-03

Applicant: Nagase ChemteX Corporation

Inventor： Daisuke MORI ,  Masahiro ASAHARA ,  Katsushi KAN ,  Eiichi NOMURA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56

Abstract: [Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention provides a multi-layer sheet for mold underfill encapsulation, which is characterized by having provided as an outermost layer thereof an (A) layer that comprises a resin composition having a local maximum loss tangent (tan δ) value of 3 or more at a measurement temperature of 125° C. for a measurement time of 0-100 seconds.