公开(公告)号：US20240071781A1

公开(公告)日：2024-02-29

申请号：US18263552

申请日：2022-01-27

Applicant: Nagase Chemtex Corporation

Inventor： Yosuke OI ,  Masahiro ASAHARA ,  Daisuke MORI

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121

Abstract: A method for sealing an electronic component mounting substrate including: preparing an electronic component mounting substrate including a substrate and electronic components mounted thereon and having a space between an electronic component and the substrate; placing a thermosetting sheet on the electronic component mounting substrate; and heat-molding the placed thermosetting sheet, to allow a melt of the thermosetting sheet to fill the space between the electronic component and the substrate and be cured. When a distance between the center of the substrate and an optional point P on a frame line that surrounds all the electronic components and minimizes the surrounded area is denoted by Lp, a distance Lq between the center of the substrate and a point Q at which a straight line passing through the point P and the center of the substrate intersects with an outer periphery of the thermosetting sheet is 0.9Lp or more.

公开(公告)号：US20210403765A1

公开(公告)日：2021-12-30

申请号：US17293327

申请日：2019-07-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Eiichi NOMURA ,  Katsushi KAN ,  Daisuke MORI ,  Yosuke OI ,  Yukio YADA ,  Takashi HIRAOKA ,  Takeyuki KITAGAWA

IPC: C09J7/35 ,  C09J7/10 ,  C09J11/04 ,  B32B9/00 ,  B32B9/04 ,  B32B27/38 ,  B32B27/30 ,  B32B27/36 ,  B32B27/28 ,  B32B27/20 ,  H01L23/29

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

公开(公告)号：US20210054187A1

公开(公告)日：2021-02-25

申请号：US16963292

申请日：2019-01-23

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yosuke OI ,  Takashi HIRAOKA

IPC: C08L63/00 ,  C08K7/18 ,  C08G59/50 ,  C08G59/62 ,  C08G59/42 ,  C08K3/36 ,  C08K5/06

Abstract: An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated.
In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided.
Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.

公开(公告)号：US20200172724A1

公开(公告)日：2020-06-04

申请号：US16610992

申请日：2018-05-30

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yasuhito FUJII ,  Katsushi KAN ,  Yosuke OI

IPC: C08L63/04 ,  C08K3/36 ,  C08K7/26 ,  B29C43/00

Abstract: To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.