公开(公告)号：US20210403765A1

公开(公告)日：2021-12-30

申请号：US17293327

申请日：2019-07-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Eiichi NOMURA ,  Katsushi KAN ,  Daisuke MORI ,  Yosuke OI ,  Yukio YADA ,  Takashi HIRAOKA ,  Takeyuki KITAGAWA

IPC: C09J7/35 ,  C09J7/10 ,  C09J11/04 ,  B32B9/00 ,  B32B9/04 ,  B32B27/38 ,  B32B27/30 ,  B32B27/36 ,  B32B27/28 ,  B32B27/20 ,  H01L23/29

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

公开(公告)号：US20210054187A1

公开(公告)日：2021-02-25

申请号：US16963292

申请日：2019-01-23

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yosuke OI ,  Takashi HIRAOKA

IPC: C08L63/00 ,  C08K7/18 ,  C08G59/50 ,  C08G59/62 ,  C08G59/42 ,  C08K3/36 ,  C08K5/06

Abstract: An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated.
In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided.
Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.